Die bond design for medium pressure sensor

A pressure sensor comprising:

• a micro-electromechanical pressure transducer (MEMS sensor) comprising:
• a first, substantially right-rectangular prism made of silicon having four, substantially vertical and substantially rectangular sides and substantially square and opposing top and bottom surfaces, the top and bottom surfaces of the first prism having four substantially equal-length sides with a first length dimension, the top and bottom surfaces having a corresponding first area, the top surface also defining a diaphragm, which deflects responsive to a pressure applied to the diaphragm, the first prism also having a first hole through the bottom surface and which extends through the first prism to an open space below the diaphragm;
• a pedestal formed from a second, substantially right-rectangular prism having four, substantially vertical and substantially rectangular sides and substantially square and opposing top and bottom opposing surfaces, the top and bottom surfaces of the second prism having four, substantially equal length sides with a second length dimension and a corresponding second area, the second length dimension being greater than the first length dimension, the second area also being greater than the first area, the second prism also having a second hole, which extends through the second prism and its top and bottom surfaces, the second hole being aligned with the first hole;
• and
• a die bond layer located between said top side of the second prism and the bottom surface of the first prism, the die bond layer being formed from a predetermined volume of a liquid adhesive, which hardens by curing, the liquid adhesive having a predetermined viscosity prior to curing, the adhesive also having a surface tension, the liquid adhesive being selected such that surface tension of the liquid adhesive causes the predetermined volume of liquid to distribute itself evenly around the second hole.