B81C 2201/0146
Processes for removing material not provided for in b81c2201/0129 - b81c2201/0145
Official title: Processes for removing material not provided for in B81C2201/0129 - B81C2201/0145
B81C2201/0146 (Processes for removing material not provided for in b81c2201/0129 - b81c2201/0145) appears on 29 US grants and 36 published applications in this corpus.
Search patents in B81C- Granted patents
- 29
- Published applications
- 36
- Assignees
- 32
- Inventors
- 88
- Latest grant
- 23 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 2 |
| 2003 | 2 | 0 |
| 2004 | 1 | 1 |
| 2005 | 1 | 1 |
| 2006 | 0 | 0 |
| 2007 | 1 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 2 |
| 2010 | 2 | 1 |
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 3 | 0 |
| 2015 | 0 | 2 |
| 2016 | 0 | 1 |
| 2017 | 0 | 1 |
| 2018 | 3 | 0 |
| 2019 | 0 | 2 |
| 2020 | 1 | 2 |
| 2021 | 2 | 4 |
| 2022 | 3 | 5 |
| 2023 | 3 | 1 |
| 2024 | 2 | 3 |
| 2025 | 4 | 2 |
| 2026 | 0 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Capless semiconductor package with a micro-electromechanical system (mems)23 Sep 2025US 12,421,108 B2STMicroelectronics S.r.l.
- Hermetically sealed transparent cavity and package for same19 Aug 2025US 12,391,544 B2Schott AG
- Method of manufacturing mirror device5 Aug 2025US 12,378,111 B2Hamamatsu Photonics K.K.
- Bonding process for forming semiconductor device structure25 Mar 2025US 12,258,265 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Capless semiconductor package with a micro-electromechanical system (MEMS)13 Feb 2024US 11,897,763 B2STMicroelectronics S.r.l.
- Absorbing Gas Species from a Cavity of a Vapor Cell9 Apr 2026US 2026/0098877 A1Quantum Valley Ideas Laboratories
- Forming Antirelaxation Coatings on Interior Surfaces of Vapor Cells9 Apr 2026US 2026/0099125 A1Quantum Valley Ideas Laboratories
- Antirelaxation Coatings for Vapor Cells9 Apr 2026US 2026/0100716 A1Quantum Valley Ideas Laboratories
- High speed manufacture of micro-electrical mechanical systems arrays29 Jan 2026US 2026/0028223 A1The University of British Columbia
- Method for manufacturing member with recess structure and member with recess structure3 Jul 2025US 2025/0215319 A1AGC Inc.
Most cited
By later US patents
- Methods of forming void regions dielectric regions and capacitor constructions26US 6,140,200 AMicron Technology, Inc. · 2000
- Process for creating a 3-dimensional configuration on a substrate6US 7,169,989 B2Ben-Gurion University of the Negev Research and Development Authority · 2007
- Production of diaphragms over a cavity by grinding to reduce wafer thickness5US 6,551,851 B2Randox Laboratories Limited · 2003
- Methods for forming void regions, dielectric regions and capacitor constructions4US 6,667,219 B1Micron Technology, Inc. · 2003
- Metal lift-off systems and methods using liquid solvent and frozen gas3US 7,655,496 B1FLIR Systems, Inc. · 2010