Production of diaphragms over a cavity by grinding to reduce wafer thickness
AssigneeRandox Laboratories Limited
InventorsHarold S Gamble, S J Neil Mitchell, Andrzej Prochaska, Stephen Peter Fitzgerald
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Abstract
A method of manufacturing a diaphragm utilising a precision grinding technique after etching a cavity in a wafer. A technique for preventing distortion of the diaphragm based on use of a sacrificial layer of porous silicon is disclosed.
Claims12
A method of manufacturing a diaphragm over a cavity, the method comprising forming a diaphragm by reducing the thickness of a first wafer by grinding, while said diaphragm is supported by a previously formed sacrificial region of sacrificial material, and removing the sacrificial material to provide a cavity under the diaphragm.
A method of manufacturing a drop-on-demand dispenser, the method comprising manufacturing a diaphragm over a cavity by forming a region of sacrificial material in a first wafer, forming a diaphragm by reducing the thickness of said first wafer by grinding while said diaphragm is supported by said sacrificial region and removing the sacrificial material to provide a cavity under the diaphragm;
- and bonding thereto a second wafer have a nozzle communicating with the cavity.
Dependencies are inferred from the claim text.