B81B 2203/0384
Sloped profile
Official title: sloped profile
B81B2203/0384 (Sloped profile) appears on 81 US grants and 112 published applications in this corpus.
Search patents in B81B- Granted patents
- 81
- Published applications
- 112
- Assignees
- 66
- Inventors
- 240
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 1 | 4 |
| 2003 | 2 | 4 |
| 2004 | 3 | 3 |
| 2005 | 1 | 2 |
| 2006 | 0 | 6 |
| 2007 | 1 | 4 |
| 2008 | 2 | 7 |
| 2009 | 3 | 4 |
| 2010 | 3 | 7 |
| 2011 | 5 | 5 |
| 2012 | 3 | 11 |
| 2013 | 8 | 5 |
| 2014 | 7 | 5 |
| 2015 | 4 | 5 |
| 2016 | 4 | 3 |
| 2017 | 2 | 4 |
| 2018 | 2 | 6 |
| 2019 | 4 | 3 |
| 2020 | 6 | 4 |
| 2021 | 6 | 6 |
| 2022 | 2 | 2 |
| 2023 | 3 | 3 |
| 2024 | 3 | 4 |
| 2025 | 1 | 0 |
| 2026 | 4 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Microelectromechanical system for moving a mechanical part in two opposite directions11 Aug 2026US 12,706,551 B2Centre National de la Recherche Scientifique (CNRS)
- Electromechanical microsystem for moving a mechanical part in two opposite directions30 Jun 2026US 12,671,352 B2Centre National de la Recherche Scientifique (CNRS)
- Method for forming semiconductor structure9 Jun 2026US 12,649,652 B2Taiwan Semiconductor Manufacturing Company.Ltd
- MEMS microphone21 Apr 2026US 12,610,198 B2AAC Technologies PTE.Ltd.
- Membrane support for dual backplate transducers13 May 2025US 12,297,102 B2Infineon Technologies AG
- Device and method for manufacturing solid fuel microthrusters using only pcb-mems technology10 Sep 2026US 2026/0264889 A1Universidad de Sevilla
- Glass cover manufacturing using a single-crystal silicon mold11 Jun 2026US 2026/0158755 A1Murata Manufacturing Co., Ltd.
- Membrane support for dual backplate transducers11 Jun 2026US 2026/0159379 A1Infineon Technologies AG
- Mems microphone8 Jan 2026US 2026/0012734 A1AAC Technologies PTE.Ltd.
- Method for forming semiconductor structure29 Aug 2024US 2024/0286889 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Hermetic packaging and method of manufacture and use therefore60US 7,579,663 B22009
- System and method of fabricating micro cavities43US 7,265,429 B22007
- Article comprising wedge-shaped electrodes32US 6,487,001 B2Agere Systems Inc. · 2002
- Optical switch device24US 6,912,336 B2Nippon Telegraph and Telephone Corporation · 2005
- Micromechanical sound transducer having a membrane support with tapered surface24US 8,461,655 B2Infineon Technologies AG · 2013