B32B 2457/14
Semiconductor wafers
B32B2457/14 (Semiconductor wafers) appears on 650 US grants and 935 published applications in this corpus.
Search patents in B32B- Granted patents
- 650
- Published applications
- 935
- Assignees
- 315
- Inventors
- 1,814
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 3 | 7 |
| 2004 | 3 | 3 |
| 2005 | 3 | 10 |
| 2006 | 3 | 9 |
| 2007 | 1 | 14 |
| 2008 | 4 | 7 |
| 2009 | 6 | 22 |
| 2010 | 11 | 26 |
| 2011 | 16 | 37 |
| 2012 | 19 | 38 |
| 2013 | 25 | 30 |
| 2014 | 29 | 45 |
| 2015 | 27 | 95 |
| 2016 | 42 | 73 |
| 2017 | 60 | 73 |
| 2018 | 61 | 84 |
| 2019 | 57 | 67 |
| 2020 | 57 | 57 |
| 2021 | 60 | 61 |
| 2022 | 45 | 40 |
| 2023 | 30 | 42 |
| 2024 | 39 | 32 |
| 2025 | 29 | 25 |
| 2026 | 16 | 38 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Protective coating on an edge of a glass core22 Sep 2026US 12,745,669 B2Intel Corporation
- Laminate, release agent composition, and method for producing processed semiconductor substrate15 Sep 2026US 12,734,784 B2Nissan Chemical Corporation
- Adhesive bonding composition and method of use1 Sep 2026US 12,722,358 B2Immunolight, LLC
- Semiconductor device having a detachable foil, power electronics arrangement, and method for fabricating a semiconductor device25 Aug 2026US 12,721,103 B2Infineon Technologies Austria AG
- Resin composition for temporary fixation, substrate-conveying support tape, and electronic equipment device manufacturing method4 Aug 2026US 12,698,369 B2
- Aluminum-diamond composite, method for producing aluminum-diamond composite, and semiconductor package1 Oct 2026US 2026/0305340 A1Denka Company Limited
- Temporary protection film for semiconductor device manufacturing and method for manufacturing semiconductor device1 Oct 2026US 2026/0305447 A1Resonac Corporation
- Temporary protection film for semiconductor device production and semiconductor device production method1 Oct 2026US 2026/0305448 A1Resonac Corporation
- Substrate treating method and substrate treating apparatus24 Sep 2026US 2026/0285027 A1SCREEN Holdings Co., Ltd.
- Adhesive composition, laminate, method of manufacturing laminate, and method of manufacturing processed substrate24 Sep 2026US 2026/0286189 A1Nissan Chemical Corporation
Most cited
By later US patents
- Peeling method and method of manufacturing semiconductor device137US 7,351,300 B2Semiconductor Energy Laboratory Co.Ltd. · 2008
- Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion99US 9,412,727 B2Semprius, Inc. · 2016
- Gaming console with transparent sprites93US 7,115,033 B1Aristocrat Technologies Australia Pty Limited · 2006
- Method for joining conductive structures and an electrical conductive article81US 6,800,169 B2Fujitsu Limited · 2004
- Method for multi-frequency bonding51US 6,780,759 B2Silicon Genesis Corporation · 2004