Substrate treating method and substrate treating apparatus

A substrate treating apparatus for executing a substrate treating method in which a gap in a peripheral edge portion of a laminate substrate obtained by laminating a plurality of substrates is filled with a filler,

• the substrate treating method comprising:
• acquiring a first transmission image of the peripheral edge portion of the laminate substrate;
• filling the gap in the peripheral edge portion of the laminate substrate after acquisition of the first transmission image with the filler;
• acquiring a second transmission image of the peripheral edge portion after filling with the filler;
• and
• determining a filling state of the filler by comparing the first transmission image and the second transmission image,
• the substrate treating apparatus comprising:
• a spin chuck that holds the laminate substrate;
• a transmission image acquisition unit that acquires a transmission image of the peripheral edge portion of the laminate substrate;
• a dispenser that fills a gap in the peripheral edge portion of the laminate substrate with the filler;
• and
• a controller, wherein
• the transmission image acquisition unit includes:
• a light source that irradiates the peripheral edge portion of the laminate substrate with light having a wavelength that allows the light to pass through the laminate substrate;
• and
• an imaging element that can receive light passing through the peripheral edge portion of the laminate substrate, and takes the first transmission image before filling of the gap with the filler by the dispenser and the second transmission image after filling with the filler, and
• the controller determines the filling state of the filler by comparing the first transmission image and the second transmission image.