Semiconductor device having a detachable foil, power electronics arrangement, and method for fabricating a semiconductor device

A power electronics arrangement, comprising:

• a detachable foil;
• and
• a plurality of semiconductor packages or semiconductor modules arranged on the detachable foil and comprising:
• at least one power semiconductor die;
• a substrate comprising a first side and an opposite second side, wherein the at least one power semiconductor die is arranged over the first side;
• an encapsulation encapsulating the at least one power semiconductor die;
• and
• a pre-cured lamination layer covering the second side of the substrate, the pre-cured lamination layer being exposed from the encapsulation and configured to provide electrical insulation for the substrate after curing,
• wherein the semiconductor packages or semiconductor modules are arranged on the detachable foil such that the detachable foil covers the pre-cured lamination layer,
• wherein the detachable foil is configured to be removed from the pre-cured lamination layer.

A method for fabricating a semiconductor device, the method comprising:

• providing at least one power semiconductor die;
• providing a substrate comprising a first side and an opposite second side, wherein the at least one power semiconductor die is arranged over the first side;
• providing an encapsulation encapsulating the at least one power semiconductor die;
• laminating over the second side of the substrate with a pre-cured lamination layer such that the pre-cured lamination layer is exposed from the encapsulation, wherein the pre-cured lamination layer is configured to provide electrical insulation for the substrate after curing;
• and
• covering the pre-cured lamination layer with a detachable foil, the detachable foil being configured to be removed from the pre-cured lamination layer.