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US 2026/0305447 A1Published application
Temporary protection film for semiconductor device manufacturing and method for manufacturing semiconductor device
AssigneeResonac Corporation
InventorsShinnosuke TAKEGASA, Kodai ITO
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Abstract
A temporary protective film for producing a semiconductor device, comprising a support film and an adhesive layer provided on the support film, wherein the adhesive layer comprises a polymer containing alkyl (meth)acrylate and (meth)acryloylmorpholine as monomer units, and does not contain a cross-linking agent.
Claims6
A temporary protective film for production of semiconductor device, comprising:
- a support film;
- and
- an adhesive layer provided on the support film,
- wherein the adhesive layer comprises a polymer comprising alkyl (meth)acrylate and (meth)acryloylmorpholine as monomer units, and does not contain a cross-linking agent.
1 more element
A method for producing a semiconductor device comprising:
- attaching a temporary protective film to one surface side of a substrate;
- mounting a semiconductor element on a surface of the substrate opposite to the temporary protective film;
- encapsulating the semiconductor element;
- and
- peeling the temporary protective film from the substrate,
- wherein the temporary protective film comprises:
- a support film;
- and
- an adhesive layer provided on the support film, and
- wherein the adhesive layer contains a polymer comprising alkyl (meth)acrylate and (meth)acryloylmorpholine as monomer units, and does not contain a cross-linking agent.
7 more elements
Dependencies are inferred from the claim text.