B24B 57/04
Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
Official title: for feeding of solid grinding, polishing or lapping agents
B24B57/04 (Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents) appears on 38 US grants and 48 published applications in this corpus.
Search patents in B24B- Granted patents
- 38
- Published applications
- 48
- Assignees
- 34
- Inventors
- 113
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 3 | 5 |
| 2003 | 2 | 0 |
| 2004 | 0 | 1 |
| 2005 | 2 | 1 |
| 2006 | 1 | 1 |
| 2007 | 1 | 2 |
| 2008 | 1 | 1 |
| 2009 | 0 | 2 |
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 3 |
| 2014 | 0 | 0 |
| 2015 | 1 | 2 |
| 2016 | 2 | 2 |
| 2017 | 1 | 2 |
| 2018 | 2 | 1 |
| 2019 | 2 | 1 |
| 2020 | 1 | 3 |
| 2021 | 0 | 2 |
| 2022 | 1 | 1 |
| 2023 | 4 | 6 |
| 2024 | 3 | 6 |
| 2025 | 1 | 1 |
| 2026 | 5 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method and apparatus to clean substrate with atomizing nozzle8 Sep 2026US 12,728,445 B2APPLIED Materials.Inc.
- Abrasive flow machining process for a meridionally divided turbine housing, and a masking fixture used in said process11 Aug 2026US 12,703,064 B2Garrett Transportation I Inc.
- Slurry dispersion system with real time control16 Jun 2026US 12,654,284 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Condensed gas pad conditioner21 Apr 2026US 12,605,802 B2APPLIED Materials.Inc.
- Vibratory grinding device6 Jan 2026US 12,515,293 B2Rösler Holding GmbH
- Polishing device1 Oct 2026US 2026/0295765 A1Ebara Corporation
- Abrasive flow machining process for a meridionally divided turbine housing, and a masking fixture used in said process1 Oct 2026US 2026/0295774 A1Garrett Transportation I Inc.
- Slurry dispersion system with real time control17 Sep 2026US 2026/0273693 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate polishing apparatus28 May 2026US 2026/0145296 A1Samsung Electronics Co., Ltd.
- Polishing apparatus25 Dec 2025US 2025/0387868 A1Ebara Corporation
Most cited
By later US patents
- Delivery system for magnetorheological fluid34US 6,955,589 B2QED Technologies, Inc. · 2005
- Metallized pad polishing process31US 5,707,492 AMotorola, Inc. · 1998
- Pressurized delivery system for abrasive particulate material26US 6,425,804 B1Hewlett-Packard Company · 2002
- Method of honing a knife blade12US 5,645,470 A1997
- Polish pad and chemical mechanical polishing apparatus comprising the same7US 7,364,497 B2Samsung Electronics Co., Ltd. · 2008