Polish pad and chemical mechanical polishing apparatus comprising the same

A chemical mechanical polishing apparatus comprising:

• a platen having a slurry flow passageway extending therein and open at an upper surface thereof;
• a slurry supply unit connected to said slurry flow passageway;
• a polishing pad disposed on the upper surface of said platen, said polishing pad having an upper surface,
• main grooves extending in the upper surface and separating an upper portion of the pad into a plurality of cells, wherein the main grooves delimit the cells,
• at least one of the cells consisting of a land portion, and a grooved portion, the grooved portion being substantially enclosed by the land portion and defined by at least one groove extending in the upper surface of the pad within the cell, wherein each said at least one groove has a bottom delimited by a surface of the pad which is located intermediate the major upper and lower surfaces of the pad, and
• a respective slurry hole open to the major lower surface of the pad and extending through the pad to the bottom of the at least one groove defining the grooved portion of each of said at least one of the cells, and each said slurry hole being in fluid communication with the slurry flow passageway of the slurry supply unit, whereby slurry supplied through the slurry hole towards the upper surface of the pad will feed into the at least one groove;
• and
• a polishing head disposed above said platen and operative to force a surface of a substrate to be polished against the polishing pad,
• wherein the at least one groove includes a first major groove intersecting the location to which the respective slurry hole extends in the cell, and a second major groove intersecting the location to which the respective slurry hole extends in the cell.