B24B 57/00
Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
Official title: Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents (for abrasive blasting B24C1/00, B24C7/00)
B24B57/00 (Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents) appears on 1,046 US grants and 1,059 published applications in this corpus.
Search patents in B24B- Granted patents
- 1,046
- Published applications
- 1,059
- Assignees
- 427
- Inventors
- 2,359
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 4 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 1 | 0 |
| 1996 | 5 | 0 |
| 1997 | 16 | 0 |
| 1998 | 27 | 0 |
| 1999 | 31 | 0 |
| 2000 | 71 | 0 |
| 2001 | 74 | 32 |
| 2002 | 79 | 73 |
| 2003 | 86 | 74 |
| 2004 | 57 | 66 |
| 2005 | 62 | 46 |
| 2006 | 40 | 31 |
| 2007 | 36 | 47 |
| 2008 | 11 | 28 |
| 2009 | 16 | 22 |
| 2010 | 12 | 31 |
| 2011 | 17 | 22 |
| 2012 | 23 | 30 |
| 2013 | 21 | 22 |
| 2014 | 16 | 18 |
| 2015 | 15 | 25 |
| 2016 | 12 | 19 |
| 2017 | 16 | 30 |
| 2018 | 17 | 30 |
| 2019 | 35 | 37 |
| 2020 | 28 | 50 |
| 2021 | 17 | 46 |
| 2022 | 28 | 49 |
| 2023 | 49 | 55 |
| 2024 | 39 | 70 |
| 2025 | 28 | 61 |
| 2026 | 31 | 45 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- System and method for real time inline mixing CMP slurry6 Oct 2026US 12,752,394 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing method for gallium nitride wafer6 Oct 2026US 12,757,663 B2Disco Corporation
- Fluid dispensing device with coupling to power-driven turning tools and turning tool comprising the same29 Sep 2026US 12,746,630 B2
- Retainer ring, chemical mechanical polishing apparatus, and substrate polishing method29 Sep 2026US 12,746,638 B2Samsung Electronics Co., Ltd.
- Coating removal apparatus and method22 Sep 2026US 12,741,353 B2Yield Engineering Systems, Inc.
- Slurry monitoring device, cmp system and method of in-line monitoring a slurry8 Oct 2026US 2026/0307205 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Slurry recycling for chemical mechanical planarazation system8 Oct 2026US 2026/0307209 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing apparatus and substrate processing method8 Oct 2026US 2026/0314295 A1Ebara Corporation
- Polishing device1 Oct 2026US 2026/0295765 A1Ebara Corporation
- Polishing pad and method for polishing object to be polished1 Oct 2026US 2026/0295770 A1Kureha Corporation
Most cited
By later US patents
- Continuous processing system for chemical mechanical polishing501US 5,738,574 AAPPLIED Materials.Inc. · 1998
- System for real-time control of semiconductor wafer polishing including optical monitoring282US 5,658,183 AMicron Technology, Inc. · 1997
- System for real-time control of semiconductor wafer polishing including optical montoring249US 5,730,642 AMicron Technology, Inc. · 1998
- System for real-time control of semiconductor wafer polishing186US 5,851,135 AMicron Technology, Inc. · 1998
- Chemical/mechanical planarization (CMP) apparatus and polish method180US 5,575,706 ATaiwan Semiconductor Manufacturing Company.Ltd · 1996