B24B 57/02
Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
Official title: for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
B24B57/02 (Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents) appears on 945 US grants and 953 published applications in this corpus.
Search patents in B24B- Granted patents
- 945
- Published applications
- 953
- Assignees
- 376
- Inventors
- 2,146
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 0 | 0 |
| 1996 | 5 | 0 |
| 1997 | 14 | 0 |
| 1998 | 24 | 0 |
| 1999 | 28 | 0 |
| 2000 | 69 | 0 |
| 2001 | 73 | 32 |
| 2002 | 75 | 67 |
| 2003 | 81 | 70 |
| 2004 | 56 | 63 |
| 2005 | 58 | 44 |
| 2006 | 37 | 28 |
| 2007 | 31 | 39 |
| 2008 | 10 | 23 |
| 2009 | 13 | 14 |
| 2010 | 10 | 25 |
| 2011 | 12 | 17 |
| 2012 | 20 | 27 |
| 2013 | 17 | 14 |
| 2014 | 15 | 14 |
| 2015 | 10 | 20 |
| 2016 | 10 | 17 |
| 2017 | 13 | 28 |
| 2018 | 14 | 26 |
| 2019 | 32 | 35 |
| 2020 | 27 | 45 |
| 2021 | 16 | 44 |
| 2022 | 27 | 46 |
| 2023 | 42 | 49 |
| 2024 | 36 | 64 |
| 2025 | 27 | 61 |
| 2026 | 27 | 41 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- System and method for real time inline mixing CMP slurry6 Oct 2026US 12,752,394 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing method for gallium nitride wafer6 Oct 2026US 12,757,663 B2Disco Corporation
- Fluid dispensing device with coupling to power-driven turning tools and turning tool comprising the same29 Sep 2026US 12,746,630 B2
- Retainer ring, chemical mechanical polishing apparatus, and substrate polishing method29 Sep 2026US 12,746,638 B2Samsung Electronics Co., Ltd.
- Coating removal apparatus and method22 Sep 2026US 12,741,353 B2Yield Engineering Systems, Inc.
- Slurry monitoring device, cmp system and method of in-line monitoring a slurry8 Oct 2026US 2026/0307205 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Slurry recycling for chemical mechanical planarazation system8 Oct 2026US 2026/0307209 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing apparatus and substrate processing method8 Oct 2026US 2026/0314295 A1Ebara Corporation
- Polishing pad and method for polishing object to be polished1 Oct 2026US 2026/0295770 A1Kureha Corporation
- Polishing pad and method for polishing object to be polished1 Oct 2026US 2026/0295771 A1Kureha Corporation
Most cited
By later US patents
- Continuous processing system for chemical mechanical polishing501US 5,738,574 AAPPLIED Materials.Inc. · 1998
- System for real-time control of semiconductor wafer polishing including optical monitoring282US 5,658,183 AMicron Technology, Inc. · 1997
- System for real-time control of semiconductor wafer polishing including optical montoring249US 5,730,642 AMicron Technology, Inc. · 1998
- System for real-time control of semiconductor wafer polishing186US 5,851,135 AMicron Technology, Inc. · 1998
- Chemical/mechanical planarization (CMP) apparatus and polish method180US 5,575,706 ATaiwan Semiconductor Manufacturing Company.Ltd · 1996