Retainer ring, chemical mechanical polishing apparatus, and substrate polishing method
AssigneeSamsung Electronics Co., Ltd.
InventorsSangyun Lee, Younghun Kim
Life of this patent
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Abstract
Provided is a retainer ring, a chemical mechanical polishing apparatuses including the same, and a substrate polishing method using the same. A slurry groove is upwardly recessed from a bottom surface of the retainer ring. The slurry groove extends in an arc shape from an inner surface of the retainer ring toward an outer surface of the retainer ring. A curvature radius of the slurry groove is greater than a distance between a center of the retainer ring and a curvature center of the slurry groove.
Claims19
A retainer ring for chemical mechanical polishing, comprising:
- a slurry groove upwardly recessed from a bottom surface of the retainer ring,
- wherein the slurry groove extends in an arc shape from an inner surface of the retainer ring toward an outer surface of the retainer ring,
- wherein a curvature radius of the slurry groove is greater than a distance between a center of the retainer ring and a curvature center of the slurry groove, and
- wherein the curvature radius of the slurry groove is greater than a radius of the inner surface.
A chemical mechanical polishing apparatus, comprising:
- a platen that supports a polishing pad;
- and
- a polishing head on the platen, the polishing head comprising:
- a polishing head body that supports a substrate;
- and
- a retainer ring coupled to a bottom surface of the polishing head body, wherein a bottom surface of the retainer ring comprises a slurry groove,
- wherein the slurry groove extends from an inner surface of the retainer ring toward an outer surface of the retainer ring,
- wherein a curvature radius of the slurry groove is greater than a distance between a center of the retainer ring and a curvature center of the slurry groove, and
- wherein the curvature radius of the slurry groove is greater than a radius of the inner surface.
A substrate polishing method, comprising:
- placing a substrate into a chemical mechanical polishing apparatus, wherein placing the substrate into the chemical mechanical polishing apparatus comprises:
- placing the substrate on a polishing head, the polishing head comprising:
- a polishing head body that supports the substrate;
- and
- a retainer ring coupled to a bottom surface of the polishing head body, a bottom surface of the retainer ring comprising a plurality of slurry grooves, each of the plurality of slurry grooves being connected to an outer surface of the retainer ring while drawing an arc shape in a counterclockwise direction from an inner surface of the retainer ring, wherein a curvature radius of each the plurality of slurry grooves is greater than a radius of the inner surface;
- and
- polishing the substrate, wherein polishing the substrate comprises:
- rotating the polishing head in a counterclockwise direction to rotate the substrate;
- rotating a polishing pad;
- and
- causing the rotating substrate to contact the rotating polishing pad.
Dependencies are inferred from the claim text.