Slurry dispersion system with real time control
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsI-Chen Chiang, Hwai-Te Chiu, Yi-Tsang Chen, Chih-Chiang Tseng, Yung-Long Chen
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsI-Chen Chiang, Hwai-Te Chiu, Yi-Tsang Chen, Chih-Chiang Tseng, Yung-Long Chen
Estimating the term…
A slurry dispersion system is provided, and includes a slurry source system, an in-line analyzer and a controller. The slurry source system provides a slurry for a chemical mechanical polishing (CMP) process. The in-line analyzer measures at least large particle count (LPC) value of a sampled slurry sampled from the slurry dispersion system, and generates an indication signal based on the LPC value, in which the indication signal indicates at lease one characteristic of the slurry. The controller receives the indication signal, and generates a control signal based on the indication signal for performing a real time control on the slurry dispersion system for controlling quality of the slurry.
A slurry dispersion system, comprising:
A method for feedback controlling a slurry dispersion system, the slurry dispersion system having a slurry source system, a reactor and a slurry supply system, the slurry source system configured to store an undiluted slurry and transport the undiluted slurry to the reactor, the reactor configured to mix the undiluted slurry with at least one chemical to obtain a mixed slurry and transport the mixed slurry to the slurry supply system, the slurry supply system configured to store the mixed slurry and output the mixed slurry for a chemical mechanical polishing (CMP) process, and the slurry supply system including a filter configured to filter the mixed slurry, the method comprising:
A method for feedback controlling a slurry dispersion system, the slurry dispersion system having a slurry source system, a reactor and a slurry supply system, the slurry source system configured to store an undiluted slurry and transport the undiluted slurry to the reactor, the reactor configured to mix the undiluted slurry with at least one chemical to obtain a mixed slurry and transport the mixed slurry to the slurry supply system, the slurry supply system configured to store the mixed slurry and output the mixed slurry for a chemical mechanical polishing (CMP) process, and the slurry supply system including a filter configured to filter the mixed slurry, the method comprising:
Dependencies are inferred from the claim text.