B24B 49/03
According to the final size of the previously ground workpiece
Official title: according to the final size of the previously ground workpiece
B24B49/03 (According to the final size of the previously ground workpiece) appears on 79 US grants and 75 published applications in this corpus.
Search patents in B24B- Granted patents
- 79
- Published applications
- 75
- Assignees
- 56
- Inventors
- 196
- Latest grant
- 13 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 4 | 0 |
| 2002 | 3 | 7 |
| 2003 | 5 | 5 |
| 2004 | 0 | 2 |
| 2005 | 7 | 8 |
| 2006 | 4 | 2 |
| 2007 | 7 | 2 |
| 2008 | 1 | 5 |
| 2009 | 0 | 3 |
| 2010 | 4 | 2 |
| 2011 | 3 | 1 |
| 2012 | 1 | 1 |
| 2013 | 3 | 0 |
| 2014 | 2 | 5 |
| 2015 | 3 | 3 |
| 2016 | 2 | 2 |
| 2017 | 2 | 2 |
| 2018 | 3 | 1 |
| 2019 | 3 | 7 |
| 2020 | 2 | 1 |
| 2021 | 1 | 1 |
| 2022 | 1 | 2 |
| 2023 | 4 | 3 |
| 2024 | 1 | 4 |
| 2025 | 3 | 3 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Surface processing of semiconductor workpieces13 Jan 2026US 12,525,457 B2Wolfspeed, Inc.
- Systems and methods for processing semiconductor wafers using front-end processed wafer edge geometry metrics2 Dec 2025US 12,487,185 B2GlobalWafers Co., Ltd.
- Semiconductor wafers using front-end processed wafer global geometry metrics12 Aug 2025US 12,385,850 B2GlobalWafers Co., Ltd.
- Method of double-side polishing work, method of producing work, and double-side polishing apparatus for a work27 May 2025US 12,311,496 B2Sumco Corporation
- Substrate processing control system, substrate processing control method, and program16 Jul 2024US 12,036,634 B2Ebara Corporation
- Method and apparatus for calculating grinding allowance of workpiece in laser cladding additive manufacturing10 Sep 2026US 2026/0264194 A1China Academy of Machinery Wuhan Research Institute of Materials Protection Co. Ltd.
- Systems and methods for processing semiconductor wafers using front-end processed wafer global geometry metrics5 Mar 2026US 2026/0063568 A1GlobalWafers Co., Ltd.
- Systems and methods for enhanced wafer manufacturing19 Feb 2026US 2026/0051038 A1
- Surface Processing of Semiconductor Workpieces11 Dec 2025US 2025/0379058 A1Wolfspeed, Inc.
- Device for measuring wafer polishing amount, and measurement method therefor6 Feb 2025US 2025/0041988 A1SK Siltron Co., Ltd.
Most cited
By later US patents
- Performing chemical mechanical polishing of oxides and metals using sequential removal on multiple polish platens to increase equipment throughput83US 5,816,891 AAdvanced Micro Devices, Inc. · 1998
- Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities68US 7,082,345 B2APPLIED Materials.Inc. · 2006
- Method and system for in-situ optimization for semiconductor wafers in a chemical mechanical polishing process48US 6,159,075 AVLSI Technology, Inc. · 2000
- Method and apparatus for controlling within-wafer uniformity in chemical mechanical polishing46US 6,276,989 B1Advanced Micro Devices, Inc. · 2001
- Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life44US 6,910,947 B2APPLIED Materials.Inc. · 2005