Substrate processing control system, substrate processing control method, and program

A system for controlling a polisher that locally polishes a substrate, the substrate processing control system comprising:

• a film thickness distribution estimation controller that measures the film thickness of the substrate and estimates the film thickness distribution of the substrate based on the measurement result;
• a local polishing region setting controller for setting a local polishing region on the substrate based on the film thickness distribution;
• a polishing head selection controller for selecting a polishing head based on the size of the local polishing region;
• a model storage holding a recipe generating model that defines the relation between an input node and an output node, input nodes including (i) an attribute of the local polishing region that includes the estimated average film thickness thereof and (ii) a head type, and the output node comprises a recipe for a polishing process;
• a polishing recipe generator that puts an attribute of the local polishing region set by the local polishing region setting controller and the polishing head selected by the polishing head selection controller into the input node of the recipe generating model and determines a polishing recipe for polishing the local polishing region;
• and
• a polishing recipe transmitter for transmitting data of the polishing recipe to a polisher that performs local polishing,
• wherein the substrate processing control system controls local polishing to be performed on an entirely polished substrate, and
• wherein the recipe generating model has a condition of the entire polishing as an input node.