Systems and methods for enhanced wafer manufacturing
OwnerTsung Chieh Lin, Sumeet Bhagavatinventors
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Abstract
A computer device is provided. The computer device includes at least one processor in communication with at least one memory device. The at least one processor is programmed to store, in the at least one memory device, a model for predicting post-grinding thickness of a wafer; receive scan data of a first inspection of a wafer; execute the model using the scan data as inputs to determine a final thickness of the wafer; compare the final thickness to one or more thresholds; determine if the final thickness exceeds at least one of the one or more thresholds; and cause a grinding station to be adjusted when it is determined that the final thickness exceeds at least one of the one or more thresholds.
Claims20
A computer device comprising at least one processor in communication with at least one memory device, wherein the at least one processor is programmed to:
- store, in the at least one memory device, a model for predicting post-grinding thickness of a wafer;
- receive scan data of a first inspection of a wafer;
- execute the model using the scan data as inputs to determine a final thickness of the wafer;
- compare the final thickness to one or more thresholds;
- determine if the final thickness exceeds at least one of the one or more thresholds;
- and
- cause a grinding station to be adjusted when it is determined that the final thickness exceeds at least one of the one or more thresholds.
A method for analyzing a wafer, the method implemented by a computing device including at least one processor in communication with at least one memory device, the method comprising:
- storing, in the at least one memory device, a model for predicting post-grinding thickness of a wafer;
- receiving scan data of a first inspection of a wafer;
- executing the model using the scan data as inputs to determine a final thickness of the wafer;
- comparing the final thickness to one or more thresholds;
- determining if the final thickness exceeds at least one of the one or more thresholds;
- and
- causing a grinding station to be adjusted when it is determined that the final thickness exceeds at least one of the one or more thresholds.
Dependencies are inferred from the claim text.