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US 12,311,496 B2Granted
Method of double-side polishing work, method of producing work, and double-side polishing apparatus for a work
AssigneeSumco Corporation
InventorsKazushige Takaishi, Chin Fu Tsai
Life of this patent
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Abstract
The sum of torques: the torque of the sun gear and the torque of the internal gear, and the ratio of the torques are controlled within predetermined ranges.
Claims16
A method of double-side polishing a work, by which a work is polished in a carrier plate rotated by a sun gear and an internal gear, the method comprising:
- setting a polishing condition depending on a target shape of the work to be obtained by polishing;
- starting polishing based on the polishing condition;
- measuring a torque of the sun gear (Ti) and a torque of the internal gear (To);
- calculating a value of a sum of the torques (Ti+To) of the measured torque of the sun gear (Ti) and the measured torque of the internal gear (To) and a value of a ratio of the torques (Ti/To) using a computer;
- setting control ranges of the sum of the torques (Ti+To) and the ratio of the torques (Ti/To) using a processor, in communication with the computer;
- and
- determining whether or not the polishing condition need to be changed based on whether or not the value of the sum of the torques (Ti+To) and the value of the ratio of the torques (Ti/To) are within the control ranges using the processor, wherein
- the carrier plate is placed between an upper plate and a lower plate of rotating plates,
- in a state in which either the value of the sum of the torques (Ti+To) or the value of the ratio of the torques (Ti/To) are outside of the control range, adjusting a rotation rate of the lower plate or a machining load applied by a pressure device, and
- in a state in which both the value of the sum of the torques (Ti+To) and the value of the ratio of the torques (Ti/To) are within the control range, continue polishing to the predetermined polishing condition.
7 more elements
A double-side polishing apparatus for a work, comprising:
- rotating plates including an upper plate and a lower plate that are rotatable;
- a sun gear placed at a center portion of the rotating plates;
- an internal gear placed around a periphery of the rotating plates;
- a carrier plate that is placed on the lower plate and is configured such that a work can be placed on the carrier plate and the carrier plate is rotated between the upper plate and the lower plate by the sun gear and the internal gear;
- a first torque sensing device, including at least a sensor, that measures a torque (Ti) of the sun gear during double-side polishing;
- a second torque sensing device, including at least a separate sensor, that measures a torque (To) of the internal gear during double-side polishing;
- a computer that receives information of the measured torques and calculates a value of a sum of the torques (Ti+To):
- the torque of the sun gear (Ti) and the torque of the internal gear (To), and a value of a ratio of the torques (Ti/To) based on the torque information;
- and
- a processor configured to set a target shape of the work to be obtained by polishing and a polishing condition, and receive the value of the sum of the torques (Ti+To) and the value of the ratio of the torques (Ti/To) from the computer,
- wherein the processor determines whether the polishing condition need to be changed based on whether or not the value of the sum of the torques (Ti+To) and the value of the ratio of the torques (Ti/To) are within control ranges,
- wherein, in a state in which either the value of the sum of the torques (Ti+To) or the value of the ratio of the torques (Ti/To) are outside of the control range, the processor is configured to adjust a rotation rate of the lower plate or a machining load applied by a pressure device, and
- wherein, in a state in which both the value of the sum of the torques (Ti+To) and the value of the ratio of the torques (Ti/To) are within the control range, the processor is configured to continue polishing to the predetermined polishing condition.
10 more elements
Dependencies are inferred from the claim text.