Systems and methods for processing semiconductor wafers using front-end processed wafer global geometry metrics

Abstract

A method for processing semiconductor wafers includes providing a first semiconductor wafer processed by a front-end process tool and obtaining measurement data along a surface of the first semiconductor wafer. The method also includes calculating a Gapi value of the first semiconductor wafer based on based on the measurement data, where the Gapi value is a global metric representing a difference between a raw shape of the first semiconductor wafer and an ideal shape of the semiconductor wafer. The method also includes determining whether the Gapi value of the first semiconductor wafer is within a predetermined threshold and either tuning the front-end process tool and processing a second semiconductor wafer with the tuned front-end process tool when the Gapi value is determined to be outside of the predetermined threshold, or sorting the first semiconductor wafer for polishing when the Gapi value is determined to be within the predetermined threshold.

Dependencies are inferred from the claim text.