B23K 3/0623
For shaped solder piece feeding
Official title: {for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets}
B23K3/0623 (For shaped solder piece feeding) appears on 570 US grants and 560 published applications in this corpus.
Search patents in B23K- Granted patents
- 570
- Published applications
- 560
- Assignees
- 227
- Inventors
- 1,184
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 4 | 0 |
| 1997 | 9 | 0 |
| 1998 | 16 | 0 |
| 1999 | 19 | 0 |
| 2000 | 29 | 0 |
| 2001 | 40 | 15 |
| 2002 | 33 | 29 |
| 2003 | 30 | 16 |
| 2004 | 16 | 24 |
| 2005 | 21 | 27 |
| 2006 | 18 | 34 |
| 2007 | 13 | 30 |
| 2008 | 12 | 42 |
| 2009 | 19 | 41 |
| 2010 | 45 | 31 |
| 2011 | 24 | 14 |
| 2012 | 22 | 24 |
| 2013 | 16 | 19 |
| 2014 | 12 | 18 |
| 2015 | 14 | 26 |
| 2016 | 16 | 26 |
| 2017 | 14 | 25 |
| 2018 | 18 | 19 |
| 2019 | 14 | 16 |
| 2020 | 17 | 13 |
| 2021 | 6 | 13 |
| 2022 | 14 | 10 |
| 2023 | 17 | 21 |
| 2024 | 9 | 10 |
| 2025 | 12 | 10 |
| 2026 | 14 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Varied ball ball-grid-array (BGA) packages1 Sep 2026US 12,727,523 B2Intel Corporation
- Ball mounting apparatus with ball attach volume control18 Aug 2026US 12,708,953 B2Texas Instruments Incorporated
- Laser-assisted soldering apparatus and solder deposition machine14 Jul 2026US 12,678,881 B2Pac Tech—Packaging Technologies GmbH
- Press-forming device for depositing solder and producing individual solder bodies2 Jun 2026US 12,643,167 B2Pac Tech—Packaging Technologies GmbH
- Flux-coated ball and method for manufacturing same26 May 2026US 12,636,737 B2Senju Metal Industry Co., Ltd.
- Varied ball ball-grid-array (bga) packages24 Sep 2026US 2026/0293779 A1Intel Foundry IP LLC
- Laser soldering apparatus having adjustable soldering position and soldering method comprising same20 Aug 2026US 2026/0241473 A1Laservall Technology Co., Ltd
- Selective stencil mask and a stencil printing method30 Jul 2026US 2026/0217046 A1STATS ChipPAC Pte. Ltd.
- Dual pump system and method to control wavesolder contact length18 Jun 2026US 2026/0173278 A1Illinois Tool Works Inc.
- Method of Forming Solder Contact Pins5 Feb 2026US 2026/0034598 A1Pac Tech—Packaging Technologies GmbH
Most cited
By later US patents
- Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device207US 5,643,831 AFujitsu Limited · 1997
- High performance flip chip package189US 6,133,634 AFairchild Semiconductor Corporation · 2000
- Method of forming an adhesive connection136US 6,077,380 AMicroFab Technologies, Inc. · 2000
- Method and apparatus for dispensing spherical-shaped quantities of liquid solder113US 5,229,016 AMicroFab Technologies, Inc. · 1993
- Solder ball supply device113US 5,467,913 ACitizen Watch Co., Ltd. · 1995