B23K 3/0607
Solder feeding devices
Official title: {Solder feeding devices}
B23K3/0607 (Solder feeding devices) appears on 1,066 US grants and 1,043 published applications in this corpus.
Search patents in B23K- Granted patents
- 1,066
- Published applications
- 1,043
- Assignees
- 463
- Inventors
- 2,208
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 4 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 7 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 4 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 9 | 0 |
| 1994 | 6 | 0 |
| 1995 | 9 | 0 |
| 1996 | 7 | 0 |
| 1997 | 16 | 0 |
| 1998 | 27 | 0 |
| 1999 | 41 | 0 |
| 2000 | 44 | 0 |
| 2001 | 55 | 18 |
| 2002 | 47 | 40 |
| 2003 | 40 | 33 |
| 2004 | 32 | 44 |
| 2005 | 31 | 41 |
| 2006 | 25 | 57 |
| 2007 | 20 | 46 |
| 2008 | 22 | 57 |
| 2009 | 25 | 56 |
| 2010 | 60 | 48 |
| 2011 | 34 | 34 |
| 2012 | 38 | 36 |
| 2013 | 27 | 33 |
| 2014 | 21 | 41 |
| 2015 | 28 | 61 |
| 2016 | 37 | 54 |
| 2017 | 34 | 43 |
| 2018 | 43 | 43 |
| 2019 | 29 | 40 |
| 2020 | 34 | 45 |
| 2021 | 29 | 41 |
| 2022 | 37 | 28 |
| 2023 | 43 | 46 |
| 2024 | 26 | 20 |
| 2025 | 19 | 24 |
| 2026 | 25 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Sealed squeegee for supplying solder paste with uniform density6 Oct 2026US 12,752,358 B2Ese Co., Ltd.
- Repair of solder bumps29 Sep 2026US 12,746,613 B2Orbotech Ltd.
- Jet soldering apparatus8 Sep 2026US 12,728,470 B2Senju Metal Industry Co., Ltd.
- Varied ball ball-grid-array (BGA) packages1 Sep 2026US 12,727,523 B2Intel Corporation
- Ball mounting apparatus with ball attach volume control18 Aug 2026US 12,708,953 B2Texas Instruments Incorporated
- Varied ball ball-grid-array (bga) packages24 Sep 2026US 2026/0293779 A1Intel Foundry IP LLC
- Solder supply device, solder supply method and printing apparatus3 Sep 2026US 2026/0257292 A1Yamaha Hatsudoki Kabushiki Kaisha
- Laser soldering apparatus having adjustable soldering position and soldering method comprising same20 Aug 2026US 2026/0241473 A1Laservall Technology Co., Ltd
- Wire buffer system13 Aug 2026US 2026/0233962 A1GM Global Technology Operations LLC
- Selective stencil mask and a stencil printing method30 Jul 2026US 2026/0217046 A1STATS ChipPAC Pte. Ltd.
Most cited
By later US patents
- Method and apparatus for dispensing small amounts of liquid material245US 5,747,102 ANordson Corporation · 1998
- Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device207US 5,643,831 AFujitsu Limited · 1997
- Method and apparatus for dispensing material in a printer206US 6,453,810 B1Speedline Technologies, Inc. · 2002
- High performance flip chip package189US 6,133,634 AFairchild Semiconductor Corporation · 2000
- Apparatus and method for injection molding solder and applications thereof186US 5,244,143 AInternational Business Machines Corporation · 1993