B23K 3/0638
For viscous material feeding
Official title: {for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence)}
B23K3/0638 (For viscous material feeding) appears on 273 US grants and 317 published applications in this corpus.
Search patents in B23K- Granted patents
- 273
- Published applications
- 317
- Assignees
- 168
- Inventors
- 607
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 6 | 0 |
| 2000 | 9 | 0 |
| 2001 | 5 | 2 |
| 2002 | 7 | 4 |
| 2003 | 4 | 3 |
| 2004 | 7 | 9 |
| 2005 | 3 | 9 |
| 2006 | 5 | 15 |
| 2007 | 7 | 12 |
| 2008 | 6 | 12 |
| 2009 | 5 | 10 |
| 2010 | 9 | 12 |
| 2011 | 8 | 11 |
| 2012 | 9 | 9 |
| 2013 | 10 | 10 |
| 2014 | 7 | 15 |
| 2015 | 10 | 27 |
| 2016 | 17 | 22 |
| 2017 | 18 | 17 |
| 2018 | 17 | 14 |
| 2019 | 13 | 15 |
| 2020 | 15 | 15 |
| 2021 | 18 | 17 |
| 2022 | 10 | 11 |
| 2023 | 17 | 21 |
| 2024 | 10 | 9 |
| 2025 | 4 | 11 |
| 2026 | 10 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Sealed squeegee for supplying solder paste with uniform density6 Oct 2026US 12,752,358 B2Ese Co., Ltd.
- Repair of solder bumps29 Sep 2026US 12,746,613 B2Orbotech Ltd.
- Jet soldering apparatus8 Sep 2026US 12,728,470 B2Senju Metal Industry Co., Ltd.
- Self correcting oven technology11 Aug 2026US 12,703,036 B2Jabil Inc.
- Battery module assembly apparatus using vision unit with illumination portion14 Apr 2026US 12,603,395 B2LG Energy Solution, Ltd.
- Solder supply device, solder supply method and printing apparatus3 Sep 2026US 2026/0257292 A1Yamaha Hatsudoki Kabushiki Kaisha
- Preheating mechanism of jet soldering apparatus, and jet soldering apparatus16 Jul 2026US 2026/0199996 A1Koki Tec Corp.
- Method, Device, Electronic Equipment, and Storage Medium for Generating Stencil Openings18 Jun 2026US 2026/0166638 A1Vayo (Shanghai) Technology Co., Ltd.
- Solder paste tube assembly device, printing machine comprising same, and solder paste tube assembly method5 Feb 2026US 2026/0034599 A1Illinois Tool Works Inc.
- Method for normalizing solder interconnects in a circuit package module after removal from a test board5 Feb 2026US 2026/0040459 A1Skyworks Solutions, Inc.
Most cited
By later US patents
- Substrate for producing a soldering connection86US 7,271,484 B2Infineon Technologies AG · 2007
- Double solder bumps on substrates for low temperature flip chip bonding73US 8,987,132 B2International Business Machines Corporation · 2015
- Method for dispensing viscous material60US 4,720,402 AAmerican Telephone and Telegraph Company · 1988
- Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package60US 5,388,327 ALSI Logic Corporation · 1995
- Mask for printing solder paste45US 5,593,080 AFujitsu Limited · 1997