Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
AssigneeLSI Logic Corporation
InventorRobert T. Trabucco
Life of this patent
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Abstract
A technique for simultaneously forming large numbers of solder ball (or bump) contacts on a surface of a substrate is described. A dissolvable film carrier is provided with holes arranged in a shape to correspond to an array of contact pads on a substrate. The holes are filled with solder. The film carrier retains the solder. The carrier is placed over the surface of the substrate and is heated, causing the solder to re-flow and to wet and to adhere to the contact pads. The carrier, which resists the re-flow temperature, maintains the shape of the solder contacts while cooling. After cooling, the film carrier can be removed from around the solder contacts with a suitable solvent.
Claims12
A method of fabricating a film carrier containing conductive bump contacts for placement on a semiconductor device package, comprising the steps of:
- forming a non-conductive film of a desired thickness;
- curing the non-conductive film;
- forming holes in the non-conductive film of a desired pattern and size;
- forming conductive contacts in the holes of the non-conductive film comprising the steps of,
- casting a molten metal into the holes of the non-conductive film,
- solidifying the molten metal to form conductive contacts;
- and
- cutting the non-conductive film containing the conductive contacts into desired shapes.
An apparatus for fabricating a film carrier containing conductive bump contacts for placement on a semiconductor device package, comprising:
- means for forming a non-conductive film of a desired thickness;
- means for curing the non-conductive film;
- means for forming holes in the non-conductive film of a desired pattern and size;
- means for forming conductive contacts in the holes of the non-conductive film comprising the steps of,
- means for casting a molten metal into the holes of the non-conductive film,
- means for solidifying the molten metal to form conductive contacts;
- and
- means for cutting the non-conductive film containing the conductive contacts into desired shapes.
Dependencies are inferred from the claim text.