Method, Device, Electronic Equipment, and Storage Medium for Generating Stencil Openings

A device for generating stencil openings, wherein the device is applied to an electronic equipment and comprises:

• an acquisition module, used to obtain a Gerber file of a PCB and extract pieces of pad pattern data from a solder-paste printing layer of the Gerber file;
• an encoding module, used to encode graphical features of the pad pattern data to obtain pad pattern codes;
• a search module, used to search for candidate component packages containing the same pad pattern codes in a preset stencil opening library based on the pad pattern codes of the pad pattern data of the PCB;
• wherein the stencil opening library stores component package information by component packages;
• wherein the component package information comprises:
• component package name, component package pattern, pad pattern data of the component packages, and stencil opening data corresponding to the component packages;
• each of the pieces of pad pattern data of the component packages corresponds to one pad pattern code;
• a matching-processing module, used to match the pad pattern data of the candidate component packages with the pad pattern data of the PCB based on the pad pattern codes;
• and
• a generation module, used to generate a stencil opening layer of the PCB based on the stencil opening data of the candidate component packages successfully matched with the pad pattern data of the PCB, to process a stencil template according to the stencil opening layer.