B23K 3/0615
Forming part of a soldering iron
Official title: {forming part of a soldering iron}
B23K3/0615 (Forming part of a soldering iron) appears on 50 US grants and 24 published applications in this corpus.
Search patents in B23K- Granted patents
- 50
- Published applications
- 24
- Assignees
- 23
- Inventors
- 99
- Latest grant
- 24 Dec 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 3 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 1 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 1 |
| 2016 | 2 | 3 |
| 2017 | 2 | 1 |
| 2018 | 0 | 4 |
| 2019 | 0 | 4 |
| 2020 | 4 | 4 |
| 2021 | 2 | 1 |
| 2022 | 2 | 0 |
| 2023 | 2 | 0 |
| 2024 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Flux, resin flux cored solder using the flux, and soldering method24 Dec 2024US 12,172,243 B2Senju Metal Industry Co., Ltd.
- Molten solder injection head with vacuum filter and differential gauge system26 Sep 2023US 11,766,729 B2International Business Machines Corporation
- Method of determining state of iron tip4 Jul 2023US 11,691,210 B2AND Co., Ltd.
- Soldering device23 Aug 2022US 11,420,282 B2Hitachi, Ltd.
- Solder processing device2 Aug 2022US 11,400,534 B2AND Co., Ltd.
- Additively depositing braze material14 Mar 2024US 2024/0082940 A1Pratt & Whitney Canada Corp.
- Flux, Resin Flux Cored Solder Using the Flux, and Soldering Method1 Jul 2021US 2021/0197323 A1Senju Metal Industry Co., Ltd.
- Soldering Device3 Dec 2020US 2020/0376580 A1Hitachi, Ltd.
- Solder processing device1 Oct 2020US 2020/0306855 A1AND Co., Ltd.
- Apparatus and method for automated soldering process18 Jun 2020US 2020/0189018 A1Lear Corporation
Most cited
By later US patents
- Solder ball connection device and capillary tube thereof32US 6,336,581 B12002
- Method and apparatus for automatically soldering a lead wire to a solar battery19US 6,357,649 B1Kaneka Corporation · 2002
- Solder placement nozzle assembly18US 5,042,708 AInternational Business Machines Corporation · 1991
- Method and apparatus for dispensing liquid solder18US 5,878,939 AEsec AG · 1999
- Method of and device for metering a solder material in a soldering device17US 4,932,581 ARobert Bosch GmbH · 1990