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US 2020/0376580 A1Published application
Soldering Device
AssigneeHitachi, Ltd.
InventorsMiki HIRAOKA, Shinya KAWAKITA, Masayuki KYOI, Osamu IKEDA
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Abstract
A soldering device capable of shortening operation time of soldering and suppressing solder non-wetting is provided. A soldering device includes: a plurality of tubular solder piece guide tubes which have space therein for a solder piece supplied from a supply port to pass through; a first holding unit which holds the solder piece guide tubes; and a heating unit which heats the first holding unit. Tip end portions of the solder piece guide tubes on a soldering side are arranged on an inner side of the first holding unit.
Claims8
A soldering device, comprising:
- a plurality of tubular solder piece guide tubes which have space therein for a solder piece supplied from a supply port to pass through;
- a first holding unit which holds the plurality of solder piece guide tubes;
- and
- a heating unit which heats the first holding unit,
- wherein tip end portions of the plurality of solder piece guide tubes on a soldering side are arranged on an inner side of the first holding unit.
2 more elements
Dependencies are inferred from the claim text.