Method and apparatus for dispensing liquid solder

A moulding die for use with an apparatus for dispensing solder, comprising:

• a component defining a moulding cavity open below and being connected to a sprue having an upper part and extending downwardly to a lower part adjacent to the moulding cavity;
• and
• wherein the upper part of the sprue is wider than, and non-linearly formed with, the part of the sprue adjacent to the moulding cavity.

A moulding die for use with an apparatus for dispensing solder, comprising:

• a component defining a moulding cavity open below and being connected to a sprue;
• and
• wherein the component further comprises vent holes connected with the moulding cavity and wherein the vent holes allow the storage of solder to supplement the volume of solder in the moulding cavity.

An apparatus for dispensing solder comprising:

• a guidance system for guiding solid solder in the form of wire or rod, said guidance system including a heated, at least approximately vertical guide tube and a narrowed outlet for liquid solder, and having a drive mechanism acting upon the solid solder for advancing it step by step towards said outlet, wherein heater means for melting the solder material are arranged for heat supply to a heating zone of the guide tube including said outlet, and cooling means for the guide tube are provided to cool a cooling zone of the guide tube adjacent to said heating zone to a temperature below the solidus temperature of the solder material.