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US 11,420,282 B2Granted
Soldering device
AssigneeHitachi, Ltd.
InventorsMiki Hiraoka, Shinya Kawakita, Masayuki Kyoi, Osamu Ikeda
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Abstract
A soldering device capable of shortening operation time of soldering and suppressing solder non-wetting is provided. A soldering device includes: a plurality of tubular solder piece guide tubes which have space therein for a solder piece supplied from a supply port to pass through; a first holding unit which holds the solder piece guide tubes; and a heating unit which heats the first holding unit. Tip end portions of the solder piece guide tubes on a soldering side are arranged on an inner side of the first holding unit.
Claims7
A soldering device, comprising:
- a plurality of tubular solder piece guide tubes which have space therein for a solder piece supplied from a supply port to pass through;
- a first holding unit which holds the plurality of solder piece guide tubes;
- and
- a heating unit which heats the first holding unit,
- wherein tip end portions of the plurality of solder piece guide tubes on a soldering side are arranged inside of the first holding unit;
- and
- a second holding unit which is arranged closer to a side of the supply port than the first holding unit and holds the plurality of solder piece guide tubes,
- wherein the plurality of solder piece guide tubes include a region exposed to external space between a portion thereof held by the first holding unit and a portion thereof held by the second holding unit.
5 more elements
Dependencies are inferred from the claim text.