Apparatus and method for automated soldering process
AssigneeLear Corporation
InventorsMichael A. FISHER, Michael HANS, John M. SEMBER
Life of this patent
Estimating the term…
Abstract
In at least one embodiment, an apparatus for an automated soldering process is provided. The apparatus includes a stepper motor to provide solder and a hot end including a casing to heat the solder and to provide liquified solder to a terminal and to an exposed portion of a wire. The apparatus includes a terminal fixture to support the terminal and the exposed portion of a wire while the hot end provides the liquified solder to the terminal and to the exposed portion of the wire. The apparatus includes a first heating device to heat the terminal and the exposed portion of the wire to enable a flow of the liquified solder onto the terminal and the exposed portion of the wire.
Claims20
An apparatus for an automated soldering process comprising:
- a stepper motor to provide solder;
- a hot end including a casing to heat the solder and to provide liquified solder to a terminal and to an exposed portion of a wire;
- a terminal fixture to support the terminal and the exposed portion of a wire while the hot end provides the liquified solder to the terminal and to the exposed portion of the wire;
- and
- a first heating device to heat the terminal and the exposed portion of the wire to enable a flow of the liquified solder onto the terminal and the exposed portion of the wire.
An apparatus for an automated soldering process comprising:
- a stepper motor to provide solder;
- a hot end to heat the solder and to provide liquified solder to a terminal and to an exposed portion of a wire;
- a terminal fixture to support the terminal and the exposed portion of a wire while the hot end provides the liquified solder to the terminal and to the exposed portion of the wire;
- and
- a first heating device to heat the terminal and the exposed portion of the wire to enable a flow of the liquified solder onto the terminal and the exposed portion of the wire.
An apparatus for an automated soldering process comprising:
- a hot end including a casing to heat the solder and to provide liquified solder to a terminal and to an exposed portion of a wire;
- a terminal fixture to support the terminal and the exposed portion of a wire while the hot end provides the liquified solder to the terminal and to the exposed portion of the wire;
- and
- a first heating device to heat the terminal and the exposed portion of the wire to enable a flow of the liquified solder onto the terminal and the exposed portion of the wire.
Dependencies are inferred from the claim text.