Method and apparatus for automatically soldering a lead wire to a solar battery

A mechanism for automatically soldering a lead wire to a solar battery via a plurality of solder bumps formed in a row at regular pitch in a lead wire soldering region of the solar battery, said mechanism comprising:

• a lead wire feeding section for feeding the lead wire;
• a lead wire chuck mechanism for chucking an end of the lead wire in the lead wire feeding section to feed out the lead wire and laying the lead wire over all length of the row of solder bumps;
• a soldering unit, having a lead holding member for holding the lead wire on the solder bump while the lead wire is laid over all length of the row of solder bumps, and a soldering iron, for repeating an operation for welding the lead wire to the solder bump by means of the soldering iron, while holding the lead wire on the solder bump by means of the lead holding member, thereby successively soldering the lead wire from one end to another to the solder bumps;
• a torque control roller for maintaining the tension on the lead wire substantially constant while the lead wire is soldered to the solder bumps and for preventing the lead wire from being wrinkled or cut during soldering;
• and
• a cutter mechanism for cutting the lead wire into a soldered lead wire and an unsoldered lead wire at a position near the lead wire feeding section.

A mechanism for automatically soldering a lead wire to a solar battery having a lead wire soldering region, said mechanism comprising:

• a preparatory soldering apparatus, having a bump soldering iron movable perpendicular to the lead wire soldering region, for forming a row of solder bumps arranged at regular pitch in the lead wire soldering region;
• and
• a lead wire soldering apparatus for supplying the lead wire onto the row of solder bumps on the solar battery, the lead wire soldering apparatus including:
• a soldering iron, having opposing sides, for welding the lead wire to the solder bumps;
• a lead holding member positioned adjacent the soldering iron;
• and
• a lead holding pin positioned adjacent the soldering iron on the side of the soldering iron opposite the lead holder member;
• wherein the lead holding member, the soldering iron, and the lead holding pin sequentially contact the lead wire with the lead holding member contacting the lead wire first, the soldering iron contacting the lead wire second, and the lead holding pin contacting the lead wire last while the soldering iron welds the lead wire to the solder bumps.