Solder processing device

A solder processing method, comprising

• sequentially supplying at least two solder pieces, each of which includes a tubular solder layer and a layer of a flux provided within the tubular solder layer, into a substantially tubular iron tip that is extended vertically, such that the at least two solder pieces are erected within the substantially tubular iron tip in such a manner that on the solder piece which is first supplied, the solder piece which is subsequently supplied rides, and
• heating the substantially tubular iron tip in a state where the at least two solder pieces are erected within the substantially tubular iron tip in such a manner that on the solder piece which is first supplied, the solder piece which is subsequently supplied rides, to melt the flux to be flown out from at least one of the at least two solder pieces to a space between an inner wall of the substantially tubular iron tip and the at least two solder pieces, thereby enhancing contactability between the inner wall of the substantially tubular iron tip and the at least two solder pieces, to melt the at least two solder pieces such that a molten solder is supplied downward from the substantially tubular iron tip, wherein
• sequentially supplying the at least two solder pieces comprises cutting a wire solder to sequentially produce a first solder piece and a second solder piece as the at least two solder pieces to thereby sequentially supply the first and second solder pieces into the substantially tubular iron tip, and
• subsequently supplying of the first and second solder pieces is performed in a state where a tip end of a terminal protruded upward from a board enters the substantially tubular iron tip from below so that the first solder piece is to be erected on the tip end of the terminal.