Method of Forming Solder Contact Pins

A solder ball placing apparatus comprising a transporting tool, a laser source, a suction generating device, and a controller configured to control the transporting tool, the laser source and the suction generating device so as to carry out a method comprising the steps:

• a) arranging a plurality of first solder balls at a plurality of arranging positions of an arranging layout of the transporting tool by using the suction generating device, said arranging layout of the transporting tool corresponding to a contact pad layout of a substrate, said contact pad layout comprising a plurality of contact pads,
• b) placing the transporting tool opposite the substrate such that the plurality of first solder balls is associated with the plurality of contact pads,
• c) placing the plurality of first solder balls onto the plurality of contact pads,
• d) melting the plurality of first solder balls and releasing the plurality of first solder balls from the transporting tool to the plurality of contact pads by using the laser source so as to form a plurality of solder bumps on the plurality of contact pads,
• e) withdrawing the transporting tool from the substrate,
• f) arranging a plurality of second solder balls at the arranging positions of the arranging layout of the transporting tool by using the suction generating device,
• g) placing the transporting tool opposite the substrate such that the plurality of second solder balls is associated with the plurality of solder bumps,
• h) placing the plurality of second solder balls onto the plurality of solder bumps,
• i) melting the plurality of second solder balls and releasing the plurality of second solder balls from the transporting tool to the plurality of solder bumps by using the laser source so as to form a plurality of monolithic solder contact pins on the plurality of contact pads, and
• j) withdrawing the transporting tool from the substrate.

A controller for a solder ball placing apparatus comprising a transporting tool, a laser source, and a suction generating device, wherein the controller is configured to control the transporting tool, the laser source and the suction generating device so as to carry out a method comprising the steps:

• a) arranging a plurality of first solder balls at a plurality of arranging positions of an arranging layout of the transporting tool by using the suction generating device, said arranging layout of the transporting tool corresponding to a contact pad layout of a substrate, said contact pad layout comprising a plurality of contact pads,
• b) placing the transporting tool opposite the substrate such that the plurality of first solder balls is associated with the plurality of contact pads,
• c) placing the plurality of first solder balls onto the plurality of contact pads,
• d) melting the plurality of first solder balls and releasing the plurality of first solder balls from the transporting tool to the plurality of contact pads by using the laser source so as to form a plurality of solder bumps on the plurality of contact pads,
• e) withdrawing the transporting tool from the substrate,
• f) arranging a plurality of second solder balls at the arranging positions of the arranging layout of the transporting tool by using the suction generating device,
• g) placing the transporting tool opposite the substrate such that the plurality of second solder balls is associated with the plurality of solder bumps,
• h) placing the plurality of second solder balls onto the plurality of solder bumps,
• i) melting the plurality of second solder balls and releasing the plurality of second solder balls from the transporting tool to the plurality of solder bumps by using the laser source so as to form a plurality of monolithic solder contact pins on the plurality of contact pads, and
• j) withdrawing the transporting tool from the substrate.