Laser-assisted soldering apparatus and solder deposition machine

A laser-assisted soldering apparatus, comprising:

• a solder jetting section that includes a jetting nozzle and a solder body holding capillary adapted to hold a solder body that is being liquefied by a laser beam;
• and
• a laser coupling unit that includes an optical window and a body with a laser entry, a laser passage, a fastening section, and a laser exit, wherein the laser passage extends lengthwise through the body from the laser entry to the laser exit, wherein the optical window is disposed towards the laser entry and is transparent to the laser beam, wherein the fastening section is disposed towards the laser exit and is fastened to the solder jetting section, wherein a first pressure gas feeding passage merges into the laser passage at a first connection location located between the optical window and the fastening section, wherein the laser passage is aligned with the solder body holding capillary, and wherein the solder jetting section includes a second pressure gas feeding passage that merges into the solder body holding capillary at a second connection location located between the laser exit of the laser coupling unit and the jetting nozzle of the solder jetting section, wherein the body includes a main body part and a pressure gas connection body part, wherein the pressure gas connection body part is attached to the main body part, and wherein gas from the first pressure gas feeding passage enters the laser passage through the pressure gas connection body part.