Press-forming device for depositing solder and producing individual solder bodies

A laser-assisted soldering apparatus, comprising:

• a press-forming mechanism configured to form a continuous strand of preformed solder sections from a wire of soldering material, wherein the press-forming mechanism is configured to press radially opposite notches into the wire, thereby forming ball-shaped preformed solder sections, wherein the preformed solder sections are disposed equidistantly along the continuous strand, and wherein the preformed solder sections are connected to each other by connecting links disposed at notches pressed into the wire by the press-forming mechanism, wherein the press-forming mechanism includes a first notched roller and a second notched roller that rotate in opposite directions, wherein the first notched roller and the second notched roller radially press the radially opposite notches into the wire, wherein the first notched roller has a first peripheral groove, and the second notched roller has a second peripheral groove, and wherein the first peripheral groove and the second peripheral groove guide the wire through the press-forming mechanism in an advancing direction planar with the first notched roller and the second notched roller;
• a separation cutter configured to form individual solder bodies by separating the preformed solder sections one by one at the connecting links;
• and
• a solder jet that holds individual solder bodies while the individual solder bodies are being liquefied by a laser beam, wherein upon being liquefied the individual solder bodies are jetted from the solder jet.