B23K 2101/40
Semiconductor devices
B23K2101/40 (Semiconductor devices) appears on 2,926 US grants and 3,339 published applications in this corpus.
Search patents in B23K- Granted patents
- 2,926
- Published applications
- 3,339
- Assignees
- 1,009
- Inventors
- 6,024
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 6 | 0 |
| 1986 | 9 | 0 |
| 1987 | 1 | 0 |
| 1988 | 8 | 0 |
| 1989 | 3 | 0 |
| 1990 | 5 | 0 |
| 1991 | 7 | 0 |
| 1992 | 5 | 0 |
| 1993 | 19 | 0 |
| 1994 | 29 | 0 |
| 1995 | 16 | 0 |
| 1996 | 36 | 0 |
| 1997 | 41 | 0 |
| 1998 | 51 | 0 |
| 1999 | 67 | 0 |
| 2000 | 79 | 0 |
| 2001 | 107 | 46 |
| 2002 | 95 | 119 |
| 2003 | 92 | 118 |
| 2004 | 102 | 153 |
| 2005 | 95 | 191 |
| 2006 | 85 | 196 |
| 2007 | 79 | 141 |
| 2008 | 91 | 159 |
| 2009 | 82 | 123 |
| 2010 | 132 | 130 |
| 2011 | 94 | 124 |
| 2012 | 106 | 113 |
| 2013 | 92 | 76 |
| 2014 | 100 | 77 |
| 2015 | 83 | 86 |
| 2016 | 66 | 95 |
| 2017 | 94 | 126 |
| 2018 | 69 | 105 |
| 2019 | 91 | 165 |
| 2020 | 110 | 119 |
| 2021 | 98 | 164 |
| 2022 | 116 | 167 |
| 2023 | 118 | 183 |
| 2024 | 119 | 136 |
| 2025 | 130 | 123 |
| 2026 | 88 | 104 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Processing apparatus6 Oct 2026US 12,752,375 B2Disco Corporation
- Repair of solder bumps29 Sep 2026US 12,746,613 B2Orbotech Ltd.
- Water washable thermal and plasma resistant coating for laser interactive applications22 Sep 2026US 12,742,076 B2
- Processing method and processing system22 Sep 2026US 12,745,588 B2Tokyo Electron Limited
- Singulation of integrated circuit package substrates with glass cores22 Sep 2026US 12,745,663 B2Intel Corporation
- Base film agent and processing method for workpiece8 Oct 2026US 2026/0314287 A1Disco Corporation
- Semiconductor Device and Method of Forming Channels in Encapsulant to Reduce Warpage in Reconstituted Wafer8 Oct 2026US 2026/0314472 A1STATS ChipPAC Pte. Ltd.
- Laser irradiation apparatus, laser processing apparatus, exposure apparatus, method for laser processing, method for exposure processing, method for installing mask, method for installing laser processing apparatus, method for installing exposure apparatus, and mask1 Oct 2026US 2026/0295721 A1Shin-Etsu Engineering Co., Ltd.
- Laser heating to adjust substrate warpage1 Oct 2026US 2026/0305233 A1APPLIED Materials.Inc.
- Processing apparatus using laser, method of laser lift-off and method of manufacturing semiconductor device24 Sep 2026US 2026/0293602 A1Kioxia Corporation
Most cited
By later US patents
- Apparatus and method for manufacturing a semiconductor device472US 10,103,040 B1ASM IP Holding B. V. · 2018
- Method for controlling configuration of laser induced breakdown and ablation454US 5,656,186 AThe Regents of the University of Michigan · 1997
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999