B23K 2101/00
Articles made by soldering, welding or cutting
B23K2101/00 (Articles made by soldering, welding or cutting) appears on 13,406 US grants and 16,355 published applications in this corpus.
Search patents in B23K- Granted patents
- 13,406
- Published applications
- 16,355
- Assignees
- 4,912
- Inventors
- 30,633
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 29 | 0 |
| 1977 | 19 | 0 |
| 1978 | 25 | 0 |
| 1979 | 18 | 0 |
| 1980 | 29 | 0 |
| 1981 | 24 | 0 |
| 1982 | 20 | 0 |
| 1983 | 27 | 0 |
| 1984 | 19 | 0 |
| 1985 | 37 | 0 |
| 1986 | 49 | 0 |
| 1987 | 62 | 0 |
| 1988 | 75 | 0 |
| 1989 | 60 | 0 |
| 1990 | 28 | 0 |
| 1991 | 31 | 0 |
| 1992 | 39 | 0 |
| 1993 | 52 | 0 |
| 1994 | 102 | 0 |
| 1995 | 83 | 0 |
| 1996 | 139 | 0 |
| 1997 | 171 | 0 |
| 1998 | 186 | 0 |
| 1999 | 223 | 0 |
| 2000 | 267 | 0 |
| 2001 | 340 | 145 |
| 2002 | 314 | 346 |
| 2003 | 335 | 365 |
| 2004 | 329 | 463 |
| 2005 | 274 | 510 |
| 2006 | 251 | 528 |
| 2007 | 209 | 453 |
| 2008 | 218 | 491 |
| 2009 | 208 | 556 |
| 2010 | 380 | 570 |
| 2011 | 319 | 569 |
| 2012 | 385 | 554 |
| 2013 | 410 | 573 |
| 2014 | 414 | 559 |
| 2015 | 447 | 725 |
| 2016 | 460 | 793 |
| 2017 | 555 | 960 |
| 2018 | 561 | 859 |
| 2019 | 741 | 968 |
| 2020 | 827 | 850 |
| 2021 | 645 | 884 |
| 2022 | 634 | 902 |
| 2023 | 654 | 842 |
| 2024 | 650 | 783 |
| 2025 | 615 | 614 |
| 2026 | 417 | 493 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B23K 2101/36Electric or electronic devicesIndexing code6,043
- B23K 2101/04Tubular or hollow articlesIndexing code2,702
- B23K 2101/001TurbinesIndexing code1,381
- B23K 2101/18Sheet panelsIndexing code1,195
- B23K 2101/006VehiclesIndexing code1,123
- B23K 2101/34Coated articlesIndexing code925
- B23K 2101/32WiresIndexing code350
- B23K 2101/16Bands or sheets of indefinite lengthIndexing code261
All 20 subgroupsShow fewer
- B23K 2101/20ToolsIndexing code254
- B23K 2101/02Honeycomb structuresIndexing code152
- B23K 2101/26Railway- or like railsIndexing code147
- B23K 2101/007MarksIndexing code122
- B23K 2101/28BeamsIndexing code115
- B23K 2101/24FrameworksIndexing code100
- B23K 2101/008GearsIndexing code93
- B23K 2101/002Drill-bitsIndexing code91
- B23K 2101/003PistonsIndexing code83
- B23K 2101/22Nets, wire fabrics or the likeIndexing code38
- B23K 2101/005CamshaftsIndexing code33
- B23K 2101/30Chains, hoops or ringsIndexing code26
Recent patents
- Manufacturing method for heat exchanger6 Oct 2026US 12,752,357 B2Daikin Industries, Ltd.
- Sealed squeegee for supplying solder paste with uniform density6 Oct 2026US 12,752,358 B2Ese Co., Ltd.
- Pin brazed mounting arrangement6 Oct 2026US 12,752,359 B1Tractian Technologies Inc
- Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump6 Oct 2026US 12,752,360 B2Resonac Corporation
- Processing apparatus6 Oct 2026US 12,752,375 B2Disco Corporation
- Steel pipe out-of-roundness prediction method, steel pipe out-of-roundness control method, steel pipe manufacturing method, steel pipe out-of-roundness prediction model generation method, and steel pipe out-of-roundness prediction device8 Oct 2026US 2026/0307127 A1Jfe Steel Corporation
- Seam position detection method, manufacturing method of welded steel pipe, quality control method of welded steel pipe, seam position detection apparatus, and manufacturing equipment of welded steel pipe8 Oct 2026US 2026/0307128 A1Jfe Steel Corporation
- Laser machining system for a timepiece component and laser machining process8 Oct 2026US 2026/0307169 A1Rolex SA
- Grain-oriented electrical steel sheet and method for manufacturing same8 Oct 2026US 2026/0307173 A1Nippon Steel Corporation
- Mounting pin holders using a laser welding process8 Oct 2026US 2026/0307182 A1Shenzhen STS Microelectronics Co., Ltd.
Most cited
By later US patents
- Forming structures from CAD solid models580US 6,391,251 B1Optomec Design Company · 2002
- Apparatus and method for manufacturing a semiconductor device472US 10,103,040 B1ASM IP Holding B. V. · 2018
- Method for controlling configuration of laser induced breakdown and ablation454US 5,656,186 AThe Regents of the University of Michigan · 1997
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995