B23K 2101/36
Electric or electronic devices
B23K2101/36 (Electric or electronic devices) appears on 6,043 US grants and 7,265 published applications in this corpus.
Search patents in B23K- Granted patents
- 6,043
- Published applications
- 7,265
- Assignees
- 2,170
- Inventors
- 13,888
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 5 | 0 |
| 1978 | 7 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 9 | 0 |
| 1984 | 8 | 0 |
| 1985 | 19 | 0 |
| 1986 | 22 | 0 |
| 1987 | 15 | 0 |
| 1988 | 27 | 0 |
| 1989 | 16 | 0 |
| 1990 | 11 | 0 |
| 1991 | 14 | 0 |
| 1992 | 13 | 0 |
| 1993 | 31 | 0 |
| 1994 | 59 | 0 |
| 1995 | 40 | 0 |
| 1996 | 78 | 0 |
| 1997 | 86 | 0 |
| 1998 | 88 | 0 |
| 1999 | 113 | 0 |
| 2000 | 141 | 0 |
| 2001 | 190 | 88 |
| 2002 | 160 | 167 |
| 2003 | 155 | 191 |
| 2004 | 177 | 241 |
| 2005 | 134 | 258 |
| 2006 | 126 | 277 |
| 2007 | 112 | 212 |
| 2008 | 116 | 230 |
| 2009 | 125 | 216 |
| 2010 | 190 | 220 |
| 2011 | 162 | 243 |
| 2012 | 179 | 237 |
| 2013 | 178 | 204 |
| 2014 | 188 | 187 |
| 2015 | 162 | 235 |
| 2016 | 160 | 259 |
| 2017 | 227 | 378 |
| 2018 | 202 | 330 |
| 2019 | 267 | 413 |
| 2020 | 329 | 360 |
| 2021 | 275 | 376 |
| 2022 | 288 | 451 |
| 2023 | 278 | 437 |
| 2024 | 303 | 415 |
| 2025 | 305 | 354 |
| 2026 | 235 | 286 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Sealed squeegee for supplying solder paste with uniform density6 Oct 2026US 12,752,358 B2Ese Co., Ltd.
- Pin brazed mounting arrangement6 Oct 2026US 12,752,359 B1Tractian Technologies Inc
- Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump6 Oct 2026US 12,752,360 B2Resonac Corporation
- Processing apparatus6 Oct 2026US 12,752,375 B2Disco Corporation
- Bonding head and bonding apparatus6 Oct 2026US 12,752,380 B2Pac Tech—Packaging Technologies GmbH
- Mounting pin holders using a laser welding process8 Oct 2026US 2026/0307182 A1Shenzhen STS Microelectronics Co., Ltd.
- Improved cable connecting piece8 Oct 2026US 2026/0312306 A1Safetrack Infrasystems SISAB AB
- Base film agent and processing method for workpiece8 Oct 2026US 2026/0314287 A1Disco Corporation
- Semiconductor Device and Method of Forming Channels in Encapsulant to Reduce Warpage in Reconstituted Wafer8 Oct 2026US 2026/0314472 A1STATS ChipPAC Pte. Ltd.
- Composite Current Collector Double-sided Double Ultrasonic Roller Welding System1 Oct 2026US 2026/0295714 A1Sheng Dong Li (Guangzhou) Ultrasonic Electronic Equipment Co., Ltd.
Most cited
By later US patents
- Apparatus and method for manufacturing a semiconductor device472US 10,103,040 B1ASM IP Holding B. V. · 2018
- Method for controlling configuration of laser induced breakdown and ablation454US 5,656,186 AThe Regents of the University of Michigan · 1997
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999