B23K 2101/42
Printed circuits
B23K2101/42 (Printed circuits) appears on 1,595 US grants and 1,653 published applications in this corpus.
Search patents in B23K- Granted patents
- 1,595
- Published applications
- 1,653
- Assignees
- 802
- Inventors
- 3,929
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 5 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 4 | 0 |
| 1982 | 1 | 0 |
| 1983 | 6 | 0 |
| 1984 | 5 | 0 |
| 1985 | 10 | 0 |
| 1986 | 13 | 0 |
| 1987 | 12 | 0 |
| 1988 | 18 | 0 |
| 1989 | 10 | 0 |
| 1990 | 5 | 0 |
| 1991 | 6 | 0 |
| 1992 | 6 | 0 |
| 1993 | 10 | 0 |
| 1994 | 14 | 0 |
| 1995 | 17 | 0 |
| 1996 | 26 | 0 |
| 1997 | 28 | 0 |
| 1998 | 27 | 0 |
| 1999 | 31 | 0 |
| 2000 | 41 | 0 |
| 2001 | 51 | 28 |
| 2002 | 37 | 29 |
| 2003 | 36 | 43 |
| 2004 | 46 | 45 |
| 2005 | 22 | 38 |
| 2006 | 25 | 50 |
| 2007 | 16 | 38 |
| 2008 | 16 | 45 |
| 2009 | 24 | 54 |
| 2010 | 33 | 39 |
| 2011 | 38 | 57 |
| 2012 | 48 | 61 |
| 2013 | 34 | 54 |
| 2014 | 34 | 59 |
| 2015 | 47 | 80 |
| 2016 | 55 | 79 |
| 2017 | 76 | 118 |
| 2018 | 62 | 89 |
| 2019 | 78 | 103 |
| 2020 | 94 | 102 |
| 2021 | 71 | 93 |
| 2022 | 82 | 105 |
| 2023 | 81 | 84 |
| 2024 | 77 | 73 |
| 2025 | 60 | 54 |
| 2026 | 44 | 33 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Sealed squeegee for supplying solder paste with uniform density6 Oct 2026US 12,752,358 B2Ese Co., Ltd.
- Bonding head and bonding apparatus6 Oct 2026US 12,752,380 B2Pac Tech—Packaging Technologies GmbH
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Self correcting oven technology11 Aug 2026US 12,703,036 B2Jabil Inc.
- Solder reflow apparatus and method of manufacturing an electronic device4 Aug 2026US 12,701,664 B2Samsung Electronics Co., Ltd.
- Mounting pin holders using a laser welding process8 Oct 2026US 2026/0307182 A1Shenzhen STS Microelectronics Co., Ltd.
- Reflow oven3 Sep 2026US 2026/0257293 A1Illinois Tool Works Inc.
- Laser soldering apparatus having adjustable soldering position and soldering method comprising same20 Aug 2026US 2026/0241473 A1Laservall Technology Co., Ltd
- Electronic module13 Aug 2026US 2026/0239542 A1Delta Electronics, Inc.
- Process Chamber with UV Irradiance30 Jul 2026US 2026/0216806 A1Yield Engineering Systems, Inc.
Most cited
By later US patents
- Additive manufacturing of active devices using dielectric, conductive and magnetic materials323US 10,254,499 B1Southern Methodist University · 2019
- Method and apparatus for dispensing small amounts of liquid material245US 5,747,102 ANordson Corporation · 1998
- Method and apparatus for dispensing small amounts of liquid material185US 6,253,957 B1Nordson Corporation · 2001
- Solder ball connect pad-on-via assembly process181US 5,275,330 AInternational Business Machines Corporation · 1994
- Beam shaping and projection imaging with solid state UV Gaussian beam to form vias138US 6,433,301 B1Electro Scientific Industries, Inc. · 2002