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US 2026/0305233 A1Published application
Laser heating to adjust substrate warpage
AssigneeApplied Materials, Inc.
InventorsWei-Sheng Lei, Michael Rice
Life of this patent
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Abstract
Embodiments described herein relate to a method that includes forming a dielectric layer over a backside surface of a substrate, where the backside surface is opposite from a device layer on the substrate, and mapping a distortion of the substrate. In an embodiment, the method further includes irradiating a portion of the dielectric layer with a laser to locally modify the dielectric layer, where the dielectric layer has a first modulus and a modified portion of the dielectric layer has a second modulus that is different than the first modulus.
Claims20
A method, comprising:
- forming a dielectric layer over a backside surface of a substrate, wherein the backside surface is opposite from a device layer on the substrate;
- mapping a distortion of the substrate;
- and
- irradiating a portion of the dielectric layer with a laser to locally modify the dielectric layer, wherein the dielectric layer has a first modulus and a modified portion of the dielectric layer has a second modulus that is different than the first modulus.
1 more element
A method, comprising:
- forming a dielectric layer over a backside surface of a substrate, wherein the backside surface is opposite from a device layer on the substrate;
- mapping a distortion of the substrate;
- and
- forming a modified region of the dielectric layer with a laser, wherein the modified region of the dielectric layer reduces the distortion of the substrate.
1 more element
A method comprising:
- forming a dielectric layer over a backside surface of a substrate, wherein the backside surface is opposite from a device layer on the substrate;
- mapping a first distortion of the substrate, wherein the first distortion exceeds a maximum distortion compatible with a chuck;
- forming a modified region of the dielectric layer with a laser heating process, wherein the modified region of the dielectric layer reduces the first distortion of the substrate to provide a substrate with a second distortion that is less than the maximum distortion compatible with the chuck;
- and
- securing the substrate to the chuck.
2 more elements
Dependencies are inferred from the claim text.