Schweizer Electronic AG
Schramberg, DE· latest recorded location
SCHWEIZER ELECTRONIC AG is named on 21 US grants and 22 published applications in this corpus. Its most frequent classification is H05K (Printed circuits).
- Granted patents
- 21
- Published applications
- 22
- Inventors
- 22
- Granted in 2026 so far
- 0
- Most recent grant
- 2 Jul 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 1 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 2 |
| 2014 | 1 | 0 |
| 2015 | 0 | 0 |
| 2016 | 2 | 2 |
| 2017 | 1 | 2 |
| 2018 | 3 | 9 |
| 2019 | 5 | 3 |
| 2020 | 6 | 0 |
| 2021 | 1 | 0 |
| 2022 | 0 | 1 |
| 2023 | 0 | 0 |
| 2024 | 1 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Technology areas
Share of 43 documents
- H05KPrinted circuits41
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by26
- H01QAntennas, i.e. radio aerials6
- Y10TTechnical subjects covered by former us classification6
- G01RMeasuring electric variables4
- G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure2
- G01SRadio direction-finding2
- G06KGraphical data reading2
- H01GCapacitors2
- H02KDynamo-electric machines2
Recent patents
- Printed circuit board module, printed circuit board element, heatsink, heat-conducting element and method of producing a thermally conductive layer2 Jul 2024US 12,028,963 B2
- Power electronic metal-ceramic module and printed circuit board module with integrated power electronic metal-ceramic module and process for their making30 Mar 2021US 10,964,635 B2
- Circuit board and method for production thereof10 Nov 2020US 10,834,810 B2
- Method for contacting a metallic contact pad in a printed circuit board and printed circuit board15 Sep 2020US 10,777,503 B2
- Radio frequency transmitting/receiving element and method for producing a radio frequency transmitting/receiving element2 Jun 2020US 10,673,123 B2
- Power semiconductor module and method for producing same23 Jul 2026US 2026/0214807 A1
- Printed circuit board module, printed circuit board element, heatsink, heat-conducting element and method of producing a thermally conductive layer9 Jun 2022US 2022/0183138 A1
- Power electronic metal-ceramic module and printed circuit board module with integrated power electronic metal-ceramic module and process for their making28 Nov 2019US 2019/0363043 A1
- Printed circuit board element with integrated electronic switching element, power converter and method for producing a printed circuit board element5 Sep 2019US 2019/0274219 A1
- Circuit board and method for production thereof18 Jul 2019US 2019/0223286 A1
Most cited
By later US patents
- Multilayer printed circuit board structure comprising an integrated electrical component, and production method therefor9US 8,072,768 B22011
- Electronic device, method for producing the same, and printed circuit board comprising electronic device7US 8,811,019 B22014
- Electronic sub-assembly and method for the production of an electronic sub-assembly2US 10,229,895 B22019
- Printed circuit board with cavity2US 9,232,647 B22016
- Printed circuit board element and method for producing a printed circuit board element1US 10,121,737 B22018