Printed circuit board module, printed circuit board element, heatsink, heat-conducting element and method of producing a thermally conductive layer
AssigneeSchweizer Electronic AG
InventorThomas GOTTWALD
Life of this patent
Estimating the term…
Abstract
Printed circuit board module (30) having a printed circuit board (50) and a heatsink (40), and, provided between the printed circuit board (50) and the heatsink (40), a two-dimensional heat-conducting element (10) comprising a ceramic carrier (12) coated with a phase change material (14, 16). In the printed circuit board (50) or the heatsink (40), a through-bore (59) may be provided to accommodate a screw (80) and one end of the screw (86) may mesh into a receiving hole (49) which preferably has a mating thread and is formed in the heatsink (40) or the printed circuit board (50), wherein a screw head (84) of the screw (80) especially has a sprung washer element (90) beneath it.
Claims11
1-10. (canceled)
Printed circuit board module, comprising:
- a printed circuit board;
- a heatsink;
- and
- a two-dimensional heat-conducting element comprising a ceramic carrier coated with a phase change material, the two-dimensional heat-conducting element being provided between the printed circuit board and the heatsink.
Printed circuit board module according to claim 1, wherein a through-bore is provided in the printed circuit board or the heatsink to accommodate a screw, and one end of the screw meshes into a receiving bore which has a mating thread and is formed in the respective other one of the heatsink or the printed circuit board, wherein a screw head of the screw is shimmed or underlaid with a resilient element.
Printed circuit board, comprising:
- a printed circuit board layer structure with a two-dimensional heat-conducting element provided on a surface intended for connection to a heatsink, the heat-conducting element comprising a ceramic carrier coated with a phase change material.
Heatsink with a two-dimensional heat-conducting element, comprising a ceramic carrier coated with a phase change material provided thereon for binding to a printed circuit board.
Heat-conducting element, comprising:
- a ceramic carrier including a coating of a phase change material, for use in a printed circuit board module.
Dependencies are inferred from the claim text.