Printed circuit board module, printed circuit board element, heatsink, heat-conducting element and method of producing a thermally conductive layer
AssigneeSchweizer Electronic AG
InventorThomas Gottwald
Life of this patent
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Abstract
Printed circuit board module (30) having a printed circuit board (50) and a heatsink (40), and, provided between the printed circuit board (50) and the heatsink (40), a two-dimensional heat-conducting element (10) comprising a ceramic carrier (12) coated with a phase change material (14, 16). In the printed circuit board (50) or the heatsink (40), a through-bore (59) may be provided to accommodate a screw (80) and one end of the screw (86) may mesh into a receiving hole (49) which preferably has a mating thread and is formed in the heatsink (40) or the printed circuit board (50), wherein a screw head (84) of the screw (80) especially has a sprung washer element (90) beneath it.
Claims3
Printed circuit board, comprising:
- a printed circuit board layer structure including projections;
- and
- a two-dimensional heat-conducting element comprising a ceramic carrier coated with a phase change material, the heat-conducting element including holes into which the projections are fitted.
Printed circuit board module, comprising:
- a printed circuit board;
- a heatsink;
- and
- a two-dimensional heat-conducting element comprising a ceramic carrier coated with a phase change material, the two-dimensional heat-conducting element being provided between the printed circuit board and the heatsink, the two-dimensional heat-conducting element including a hole, and the printed circuit board or the heatsink including a projection fitted into the hole.
Printed circuit board module, comprising:
- a printed circuit board;
- a heatsink;
- a two-dimensional heat-conducting element comprising a ceramic carrier coated with a phase change material, the two-dimensional heat-conducting element being provided between the printed circuit board and the heatsink;
- and
- the printed circuit board, the two-dimensional heat-conducting element and the heatsink are penetrated by a screw that hold the printed circuit board, the two-dimensional heat-conducting element and the heatsink together.
Dependencies are inferred from the claim text.