Printed circuit board with cavity
AssigneeSchweizer Electronic AG
InventorThomas Gottwald
Life of this patent
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Abstract
A printed circuit board multilayer construction comprising a layer stack composed of plurality of electrically insulating and/or conductive layers arranged one above another and a cavity in the interior of the layer stack, which extends laterally only in a partial region of the areal extent of the layer stack, is exposed to a pressure surrounding the printed circuit board multilayer construction through an opening provided in the layer stack and is sealed relative to ingress of liquid. Furthermore, the present invention relates to a method suitable for producing a printed circuit board multilayer construction of this type.
Claims19
A printed circuit board multilayer construction, comprising:
- a layer stack of several electrically insulating and/or conductive layers arranged one above the other;
- and
- a cavity in an interior of the layer stack, wherein the cavity extends laterally only into a partial region of an areal extent of the layer stack, and through an opening provided in the layer stack, is exposed to a pressure surrounding the printed circuit board multilayer construction;
- wherein the cavity is sealed relative to ingress of liquid with an aid of at least one liquid-impermeable membrane that is laminated in between layers of the layer stack;
- wherein the at least one liquid-impermeable membrane is inserted in the layer stack and extends only partially over the areal extent of the insulating layers.
A method for producing a printed circuit board multilayer construction comprising a layer stack of several electrically insulating and/or conductive layers arranged one above the other, and a cavity in an interior of the layer stack, wherein the cavity extends laterally only into a partial region of an areal extent of the layer stack, and through an opening provided in the layer stack, is exposed to a pressure surrounding the printed circuit board multilayer construction, and wherein the cavity is sealed relative to ingress of liquid, the method comprising the following steps of:
- providing an inner film or a multilayer core;
- producing a cutout in the inner film or the multilayer core;
- arranging further layers of the layer stack that are not part of the inner film or the multilayer core below and/or above the inner film provided with the cutout or the multilayer core provided with the cutout, whereby a cavity is formed in the interior of the layer stack, wherein the cavity extends laterally only in a partial region of the areal extent of the layer stack;
- laminating together the multilayer arrangement thus obtained;
- individually providing at least one opening in one or more of the layers forming the layer stack so that the cavity formed is exposed to a pressure surrounding the printed circuit board multilayer construction;
- and
- sealing the cavity formed relative to ingress of liquid with an aid of at least one liquid-impermeable membrane that is laminated in between layers of the layer stack;
- wherein the at least one liquid-impermeable membrane is inserted in the layer stack and extends only partially over the areal extent of the insulating layers.
A printed circuit board multilayer construction, comprising:
- a layer stack of several electrically insulating and/or conductive layers arranged one above the other including no-flow prepreg layers;
- and
- a cavity in an interior of the layer stack, wherein the cavity extends laterally only into a partial region of an areal extent of the layer stack, and through an opening provided in the layer stack, is exposed to a pressure surrounding the printed circuit board multilayer construction;
- wherein the cavity is sealed relative to ingress of liquid with an aid of at least one liquid-impermeable membrane that is laminated in between layers of the layer stack;
- wherein the at least one liquid-impermeable membrane is inserted in the layer stack and extends only partially over the areal extent of the insulating layers;
- and
- wherein the layer stack is formed by laminating together the electrically insulating and/or conductive layers using the prepreg layers.
A method for producing a printed circuit board multilayer construction comprising a layer stack of several electrically insulating and/or conductive layers arranged one above the other, and a cavity in an interior of the layer stack, wherein the cavity extends laterally only into a partial region of an areal extent of the layer stack, and through an opening provided in the layer stack, is exposed to a pressure surrounding the printed circuit board multilayer construction, and wherein the cavity is sealed relative to ingress of liquid, the method comprising the following steps of:
- providing an inner film or a multilayer core;
- producing a cutout in the inner film or the multilayer core;
- arranging further layers of the layer stack including no-flow prepreg layers that are not part of the inner film or the multilayer core below and/or above the inner film provided with the cutout or the multilayer core provided with the cutout, whereby a cavity is formed in the interior of the layer stack, wherein the cavity extends laterally only in a partial region of the areal extent of the layer stack;
- laminating together the multilayer arrangement thus obtained using the prepreg layers;
- individually providing at least one opening in one or more of the layers forming the layer stack so that the cavity formed is exposed to a pressure surrounding the printed circuit board multilayer construction;
- and
- sealing the cavity formed relative to ingress of liquid with an aid of at least one liquid-impermeable membrane that is laminated in between layers of the layer stack;
- wherein the at least one liquid-impermeable membrane is inserted in the layer stack and extends only partially over the areal extent of the insulating layers.
A printed circuit board multilayer construction, comprising:
- a layer stack of several electrically insulating and/or conductive layers arranged one above the other;
- a cavity in an interior of the layer stack, wherein the cavity extends laterally only into a partial region of an areal extent of the layer stack, and through an opening provided in the layer stack, is exposed to a pressure surrounding the printed circuit board multilayer construction;
- wherein the cavity is sealed relative to ingress of liquid with an aid of at least one liquid-impermeable membrane that is laminated in between layers of the layer stack;
- wherein the at least one liquid-impermeable membrane is inserted in the layer stack and extends only partially over the areal extent of the insulating layers;
- and
- wherein one of the further layers is an interposer for use as component carrier which the interposer covers the cutout in one direction.
A method for producing a printed circuit board multilayer construction comprising a layer stack of several electrically insulating and/or conductive layers arranged one above the other, and a cavity in an interior of the layer stack, wherein the cavity extends laterally only into a partial region of an areal extent of the layer stack, and through an opening provided in the layer stack, is exposed to a pressure surrounding the printed circuit board multilayer construction, and wherein the cavity is sealed relative to ingress of liquid, the method comprising the following steps of:
- providing an inner film or a multilayer core;
- producing a cutout in the inner film or the multilayer core;
- arranging further layers of the layer stack that are not part of the inner film or the multilayer core below and/or above the inner film provided with the cutout or the multilayer core provided with the cutout, whereby a cavity is formed in the interior of the layer stack, wherein the cavity extends laterally only in a partial region of the areal extent of the layer stack;
- laminating together the multilayer arrangement thus obtained;
- individually providing at least one opening in one or more of the layers forming the layer stack so that the cavity formed is exposed to a pressure surrounding the printed circuit board multilayer construction;
- and
- sealing the cavity formed relative to ingress of liquid with an aid of at least one liquid-impermeable membrane that is laminated in between layers of the layer stack;
- wherein the at least one liquid-impermeable membrane is inserted in the layer stack and extends only partially over the areal extent of the insulating layers;
- wherein one of the further layers is an interposer for use as component carrier which the interposer covers the cutout in one direction.
Dependencies are inferred from the claim text.