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US 10,229,895 B2Granted
Electronic sub-assembly and method for the production of an electronic sub-assembly
AssigneeSchweizer Electronic AG
InventorsThomas Gottwald, Alexander Neumann
Life of this patent
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Abstract
An electronic sub-assembly (36) comprising at least one electronic component (14) embedded in a sequence of layers, wherein the electronic component (14) is arranged in a recess of an electrically conductive central layer (16) and directly adjoins a resin layer (12, 20) on each side.
Claims8
A method for producing an electronic sub-assembly with the following steps:
- providing an electrically conductive starting substrate;
- placing at least one first layer made of electrically insulating material;
- mounting of at least one component on the at least one first layer of electrically insulating material;
- laying on the at least one first layer of electrically insulating material a first electrically conductive layer having at least one recess, the at least one recess being designed in its arrangement and dimensions to match the at least one component so that the at least one component is disposed in the at least one recess;
- applying at least a second layer made of electrically insulating material, and at least a second electrically conductive layer;
- pressing together the electrically conductive starting substrate, the at least one first layer made of electrically insulating material, the first electrically conductive layer, the at least a second layer made of electrically insulating material and the at least a second electrically conductive layer;
- and
- wherein the step of mounting of the at least one component is followed by the step of laying the first electrically conductive layer, wherein the at least one component has an elevated temperature at the moment of mounting to liquefy the at least one first layer of electrically insulating material below the at least one component.
5 more elements
A method for producing an electronic sub-assembly with the following steps:
- providing an electrically conductive starting substrate;
- placing at least one first layer made of electrically insulating material;
- mounting of at least one component on the at least one first layer of electrically insulating material;
- laying on the at least one first layer of electrically insulating material a first electrically conductive layer having at least one recess, the at least one recess being designed in its arrangement and dimensions to match the at least one component so that the at least one component is disposed in the at least one recess;
- applying at least a second layer made of electrically insulating material, and at least a second electrically conductive layer;
- pressing together the electrically conductive starting substrate, the at least one first layer made of electrically insulating material, the first electrically conductive layer, the at least a second layer made of electrically insulating material and the at least a second electrically conductive layer;
- and
- wherein the step of laying the first electrically conductive layer is followed by the step of mounting of the at least one component, wherein the first electrically conductive layer has an elevated temperature at the moment of mounting.
5 more elements
Dependencies are inferred from the claim text.