Circuit board and method for production thereof
AssigneesSchweizer Electronic AG, Continental Automotive GmbH
InventorsHubert Trageser, Alexander Neumann
Life of this patent
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Abstract
A circuit board (10, 10′, 10″) includes at last one insulating substrate layer (SL1, SL2, SL3, SL4, SL5) and a plurality of electrically conductive copper coats (C1, C2, C3) arranged on the at least one insulating substrate layer (SL1, SL2, SL3, SL4, SL5), wherein at least one of the electrically conductive copper coats (C1, C2, C3) is coated at least on both sides with a layer (HSI, HS2, HS3) made of a material for inhibiting electromigration, wherein on a layer (HS1, HS2) made of a material for inhibiting electromigration a further metal layer (M1, M2, M3, M3′) is provided, which is in turn coated with a further layer (HS3, HS3′) made of a material for inhibiting electromigration.
Claims15
A circuit board, comprising:
- at least one insulating substrate layer and a multiplicity of electrically conductive copper layers arranged on the at least one insulating substrate layer;
- and
- at least one of the electrically conductive copper layers is coated on both sides with an intermediate layer and an upper layer, respectively, for inhibiting electromigration, a further metal layer being provided on the upper layer for inhibiting electromigration, which further metal layer is in turn coated with a further layer for inhibiting electromigration, the intermediate layer being disposed between the at least one insulating substrate layer and the at least one of the electrically conductive copper layers.
A method for producing a circuit board, the method comprising the following steps:
- forming a layer sequence of a substrate layer and a copper layer with an intermediate layer for inhibiting electromigration;
- applying an upper layer for inhibiting electromigration onto the copper layer;
- depositing a further metal layer onto the upper layer for inhibiting electromigration;
- etching the layer sequence formed, in order to form conductor structures;
- depositing a further layer for inhibiting electromigration.
Dependencies are inferred from the claim text.