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US 2019/0363043 A1Published application
Power electronic metal-ceramic module and printed circuit board module with integrated power electronic metal-ceramic module and process for their making
AssigneeSchweizer Electronic AG
InventorsThomas GOTTWALD, Christian Rössle
Life of this patent
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Abstract
A power-electronic metal-ceramic module (10) comprising a metal-ceramic substrate (12) made of a ceramic carrier (14) having a metal top and bottom ply (16, 18), which is joined on or in the metal top ply (16) and/or the metal bottom ply (18) with a metal layer (16, 18, 22, 23) forming a frame (24) for accommodating at least one electronic component (30) and at least one electronic component (30) accommodated in the frame (24).
Claims17
Power-electronic metal-ceramic module comprising:
- a metal-ceramic substrate made of a ceramic carrier having a metal top ply and a metal bottom ply, which is joined on or in the metal top ply or the metal bottom ply to a metal layer forming a frame for accommodating at least one electronic component;
- and
- at least one electronic component accommodated in the frame.
Method for producing a power-electronic metal-ceramic module comprising the following steps:
- providing a metal-ceramic substrate made of a ceramic carrier having a metal top ply and a metal bottom ply;
- forming a frame to accommodate at least one electronic component in or on the metal layer;
- placing at least one electronic component in such a way that the at least one electronic component is positioned in the frame;
- joining the layer sequence formed in this manner.
1 more element
Dependencies are inferred from the claim text.