Power electronic metal-ceramic module and printed circuit board module with integrated power electronic metal-ceramic module and process for their making

Method for producing a circuit board module with integrated power-electronic metal-ceramic module, comprising the following steps to form a first layer sequence:

• providing a circuit board base frame made of metal-laminated circuit board carrier material, the circuit board base frame including a first recess for accommodating a power-electronic metal-ceramic module;
• inserting the power-electronic metal-ceramic module into the first recess in the circuit board base frame, the power-electronic metal-ceramic module comprising a ceramic carrier having a metal top ply and a metal bottom ply and a frame including a second recess accommodating an electronic component, wherein the frame is formed in the metal top ply or the metal bottom ply, or wherein the frame is formed in a metal layer applied to the metal top ply or the metal bottom ply, respectively;
• applying insulation plies and at least one metal foil to form a top metal outer ply;
• compressing the first layer sequence in such a way that a liquefaction of the insulation plies occurs and liquid resin fills up gaps between the first recess and the power-electronic metal-ceramic module and gaps between the electronic component and the frame of the metal-ceramic module and subsequently curing the insulation plies;
• and
• producing through contacts and connecting the electronic component with the top metal outer ply.