PulseForge Inc.
Austin, TX, US· latest recorded location
PulseForge Inc. is named on 9 US grants and 13 published applications in this corpus. Its most frequent classification is H10P (Generic processes or apparatus for the manufacture or treatment of devices covered).
- Granted patents
- 9
- Published applications
- 13
- Inventors
- 13
- Granted in 2026 so far
- 2
- Most recent grant
- 27 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2022 | 2 | 1 |
| 2023 | 4 | 0 |
| 2024 | 1 | 2 |
| 2025 | 0 | 5 |
| 2026 | 2 | 5 |
By publication year. 2026 runs to 8 Oct.
Technology areas
Share of 22 documents
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered17
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by8
- B23KSoldering or unsoldering7
- B32BLayered products, i.e. products built-up of strata of flat or non-flat4
- H05KPrinted circuits3
- B08BCleaning in general2
- C08JWorking-up2
- H05BElectric heating2
- B05DProcesses for applying fluent materials to surfaces, in general1
- B62BHand-propelled vehicles1
Recent patents
- Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications27 Jan 2026US 12,538,830 B2
- Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications6 Jan 2026US 12,519,078 B2
- Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications28 May 2024US 11,996,384 B2
- Method and apparatus for removing particles from the surface of a semiconductor wafer26 Sep 2023US 11,769,660 B2
- Method and apparatus for removing particles from the surface of a semiconductor wafer27 Jun 2023US 11,688,600 B1
- Roughened Carrier for Debonding of Bonded Stack6 Aug 2026US 2026/0225362 A1
- Methods and apparatus for thermal processing of materials4 Jun 2026US 2026/0151793 A1
- Method and apparatus for temporarily bonding and debonding electronics structures relative to carrier30 Apr 2026US 2026/0123346 A1
- Carrier for debonding of bonded stack with passivation layer2 Apr 2026US 2026/0096395 A1
- Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications22 Jan 2026US 2026/0026387 A1
Most cited
By later US patents
- Method and apparatus for removing particles from the surface of a semiconductor wafer3US 11,621,175 B12023
- Method for connecting surface-mount electronic components to a circuit board2US 11,317,517 B22022
- Method for curing solder paste on a thermally fragile substrate2US 11,647,594 B22023
- Method and apparatus for removing particles from the surface of a semiconductor wafer2US 11,688,600 B12023
- Method and apparatus for removing particles from the surface of a semiconductor wafer2US 11,769,660 B22023