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US 11,688,600 B1Granted
Method and apparatus for removing particles from the surface of a semiconductor wafer
AssigneePulseForge Inc.
InventorsDavid Alex Rose, Kurt A. Schroder
Life of this patent
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Abstract
A method for removing particles from a semiconductor wafer surface is disclosed. A liquid is placed on a surface of a semiconductor wafer on which particles may adhere. A light pulse is then applied to the surface of the semiconductor wafer through the liquid. The liquid containing the particles is then removed from the surface of the semiconductor wafer.
Claims10
An apparatus for removing particles from the surface of a semiconductor wafer, said apparatus comprising:
- a spin coater for spinning a wafer;
- a liquid dispenser for continuously dispensing a stream of liquid onto a surface of said wafer to which particles may adhere while said wafer is being spun;
- an encoder connected to said spin coater for determining an angular position of said spinning wafer, and a number of rotations of said spinning wafer;
- a flashlamp for emitting a plurality of light pulses to said surface of said spinning wafer while liquid is being dispensed on said spinning wafer, each of said light pulses emitted at said angular location across a radius of said spinning wafer after a predetermined amount of time has lapsed as determined by a charging rate of capacitors located within said flashlamp for delivering said each light pulse, until an entire surface of said spinning wafer has received at least one light pulse;
- and
- a particle collector for collecting said particles carried off said wafer by said stream of liquid.
3 more elements
Dependencies are inferred from the claim text.