Method for curing solder paste on a thermally fragile substrate
AssigneePulseForge Inc.
InventorRob Jacob Hendriks
Life of this patent
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Abstract
A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on a thermally fragile substrate. Multiple conductive traces are selectively deposited on the optically reflective layer and on the optically absorptive layer. Solder paste is then applied on selective locations that are corresponding to locations of the optically absorptive layer. After a component has been placed on the solder paste, the substrate is irradiated from one side with uniform pulsed light. The optically absorptive layer absorbs the pulsed light and becomes heated, and the heat is subsequently transferred to the solder paste and the component via thermal conduction in order to heat and melt the solder paste.
Claims8
A method for curing solder paste on a thermally fragile substrate, said method comprising:
- printing a first optically reflective layer and an optically absorptive layer on said thermally;
- and fragile substrate;
- selectively depositing a plurality of conductive traces on said optically reflective layer and on said optically absorptive layer;
- applying solder paste on selective locations corresponding to locations of said optically absorptive layer;
- selectively depositing a second optically reflective layer on said conductive traces and on said first optically absorptive layer;
- placing a component on said solder paste;
- and
- irradiating said thermally fragile substrate from two sides with uniform pulsed light, wherein said optically absorptive layer and said component absorb said pulsed light and becomes heated, and the heat is subsequently transferred to said solder paste via thermal conduction to melt said solder paste, wherein an energy of said pulsed light for processing said solder paste is between 3 and 30 J/cm2.
Dependencies are inferred from the claim text.